Call Number (LC) Title Results
TK7874 .F68 2020eb The fourth terminal : benefits of body-biasing techniques for FDSOI circuits and systems / 1
TK7874 .G379 2020 Integrated circuit design for radiation environments / 1
TK7874 .G573 1988 The design and analysis of VLSI circuits / 1
TK7874 .H348 2008 Handbook of 3D integration. 1
TK7874 .H393 1984 Digital system design and microprocessors / 1
TK7874 .H8835 2007eb Understanding Fabless IC Technology. 1
TK7874 .I3226 2010eb Advanced high speed devices / 1
TK7874 .I437 2019 Imaps 2018 2
TK7874 .I437 2020 IMAPS 2019 1
TK7874 .I565 2020eb Microelectronics, communication systems, machine learning and internet of things : select proceedings of MCMI 2020 / 1
TK7874 .I58 2019eb Proceedings of the fourth International Conference on Microelectronics, Computing and Communication Systems : MCCS 2019 / 1
TK7874 .I58 2020 Microelectronics, circuits and systems : select proceedings of 7th International Conference on Micro2020 / 1
TK7874 . I58 2020eb Integrated wide-bandwidth current sensing / 1
TK7874 .I58 2020eb Proceeding of fifth International Conference on Microelectronics, Computing and Communication Systems : MCCS 2020 / 1
TK7874 .I58 2021 Microelectronics, circuits and systems : select proceedings Micro2021 /
Micro-electronics and telecommunication engineering : proceedings of 5th ICMETE 2021 /
Microelectronic devices, circuits and systems : second international conference, ICMDCS 2021, Vellore, India, February 11-13, 2021 : revised selected papers /
3
TK7874 .I58 2022eb Microelectronic devices, circuits and systems : third International Conference, ICMDCS 2022, Vellore, India, August 11-13, 2022, Revised selected papers / 1
TK7874 .I584 2014eb Quantum, nano, micro technologies and applied researches : selected, peer reviewed papers from the 2013 2nd International Symposium on Quantum, Nano and Micro Technologies (ISQNM 2013), December 1-2, 2013, Singapore / 1
TK7874 .I584 2017 IMAPS-CPMT 2016 Poland. 1
TK7874 .I584 2019 IC Design Insights - from Selected Presentations at CICC 2017 1
TK7874 .L38 2023 Chiplet design and heterogeneous integration packaging / 1