Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses Fundamental Mechanisms and Application to IC Interconnect Technology

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses Fundamental Mechanisms and Application to IC Interconnect Technology / by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann.

As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main c...

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Bibliographic Details
Main Authors: Borst, Christopher Lyle (Author), Gill, William N. (Author), Gutmann, Ronald J. (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 2002.
Edition:1st ed. 2002.
Series:Springer eBook Collection.
Subjects:
Manufactures.
Electrical engineering.
Chemistry, Physical and theoretical.
Optical materials.
Electronic materials.
Electronic resources (E-books)
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