High Sensitivity Moiré Experimental Analysis for Mechanics and Materials / by Daniel Post, Bongtae Han, Peter Ifju.

Mechanical engineering, an engineering discipline born of the needs of the industrial revolution, is once again asked to do its substantial share in the call for industrial renewal. The general call is urgent as we face profound issues of productivity and competitiveness that require engineering sol...

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Bibliographic Details
Main Authors: Post, Daniel (Author), Han, Bongtae (Author), Ifju, Peter (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York, NY : Springer New York : Imprint: Springer, 1994.
Edition:1st ed. 1994.
Series:Mechanical Engineering Series,
Springer eBook Collection.
Subjects:
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.
Table of Contents:
  • 1 Introduction
  • 1.1 Our Subject
  • 1.2 Scope and Style
  • 1.3 History
  • 1.4 Comment on Exercises
  • 1.5 References
  • I
  • 2 Elements of Optics
  • 3 Geometric Moiré
  • 4 Moiré Interferometry
  • 5 Microscopic Moiré Interferometry: Very High Sensitivity
  • 6 On the Limits of Moiré Interferometry
  • II
  • 7 Laminated Composites in Compression: Free-edge Effects
  • 8 Thermal Stresses Near the Interface of a Bimaterial Joint
  • 9 Textile Composites
  • 10 Thermal Deformations in Electronic Packaging
  • 11 Advanced Composites Studies
  • 12 Metallurgy, Fracture, Dynamic Loading
  • 13 Strain Standard for Calibration of Electrical Strain Gages
  • Appendices
  • A Shadow Moiré with Enhanced Sensitivity
  • A.1 Introduction
  • A.2 Shadow Moiré with O/DFM
  • A.3 In-plane Geometric Moiré with O/DFM
  • A.4 Reference
  • B Submaster Grating Molds
  • B.1 Introduction
  • B.2 Production of Silicone Rubber Submasters
  • B.3 Production of Epoxy Submasters
  • B.4 Application of the Reflective Film
  • B.5 References
  • C Adhesives for Replication of Specimen Gratings
  • C.1 Adhesives
  • C.2 Addresses.