Structural Integrity and Reliability in Electronics Enhancing Performance in a Lead-Free Environment

Structural Integrity and Reliability in Electronics Enhancing Performance in a Lead-Free Environment / by W.J. Plumbridge, R.J. Matela, A. Westwater.

Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represe...

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Bibliographic Details
Main Authors: Plumbridge, W.J (Author), Matela, R.J (Author), Westwater, A. (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Dordrecht : Springer Netherlands : Imprint: Springer, 2003.
Edition:1st ed. 2003.
Series:Springer eBook Collection.
Subjects:
Civil engineering.
Materials science.
Manufactures.
Mechanics.
Applied mathematics.
Engineering mathematics.
Electronic resources (E-books)
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.
Table of Contents:
  • Setting the Scene
  • to the Properties of Materials
  • More Complex Mechanical Behaviour
  • Mechanical Testing (For Electronics Applications)
  • Mechanical Properties of Bulk Solders
  • Mechanical Behaviour of Solder Joints
  • Electronic Components and Their Construction
  • Printed Circuit Board Assembly Methods and Technologies
  • Fundamentals of Failure Analysis
  • Analysis of PCB and Electronic Component Failure
  • Making the Transition to a Reliable Lead-free Solder Process
  • to Life Prediction
  • Life Prediction by Crack Propagation Approach
  • Reliability and Statistical Analysis of Data
  • Thermal and Mechanical Simulation in Microelectronics
  • Finite Element Analysis
  • Non-linear Finite Element Analysis
  • Case Study.

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