Magnetic Bubble Technology

Magnetic Bubble Technology by A. H. Eschenfelder.

Magnetic bubbles are of interest to engineers because their properties can be used for important practical electronic devices and they are of interest to physicists because their properties are manifestations of intriguing physical principles. At the same time, the fabrication of useful configuratio...

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Bibliographic Details
Main Author: Eschenfelder, A. H. (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 1980.
Edition:1st ed. 1980.
Series:Springer Series in Solid-State Sciences, 14
Springer eBook Collection.
Subjects:
Electronics.
Microelectronics.
Magnetism.
Magnetic materials.
Electronic resources (E-books)
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.
Table of Contents:
  • 1. Introduction to Magnetic Bubbles
  • 1.1 What Are Magnetic Bubbles?
  • 1.2 Available Bubble Materials
  • 1.3 How Can Bubbles be Manipulated?
  • 1.4 Why Are Bubbles of Practical Interest?
  • 1.5 A Typical Storage Device
  • 1.6 Why Are Bubbles of Scientific Interest?
  • 1.7 Scope and Organization of the Book
  • 1.8 History
  • 1.9 Summary
  • 2. Static Properties of Magnetic Bubbles
  • 2.1 Fundamental Characteristics of the Bubble Film
  • 2.2 Bubble Domain Configurations
  • 2.3 Summary
  • 3. Dynamic Properties of Magnetic Bubbles
  • 3.1 Motion of a Wall
  • 3.2 Motion of a Bubble
  • 3.3 Summary
  • 4. Basic Permalloy-Bar Bubble Devices
  • 4.1 Propagation
  • 4.2 Other Functional Elements
  • 4.3 Total Chip Performance
  • 4.4 Device Scaling
  • 4.5 Summary
  • 5. Other Bubble Device Forms
  • 5.1 Two-Level Permalloy Bar
  • 5.2 Charged-Wall Bubble Devices
  • 5.3 Bubble Lattice Devices
  • 5.4 Current Sheet Devices
  • 5.5 Summary
  • 6. Bubble Materials
  • 6.1 The General Approach to Tailoring the Properties of Bubble Materials
  • 6.2 Garnets
  • 6.3 Hexaferrites
  • 6.4 Amorphous Materials
  • 6.5 Orthoferrites
  • 6.6 Summary
  • 7. Device Chip Fabrication
  • 7.1 Crystal Growth
  • 7.2 Substrate Preparation
  • 7.3 Film Growth
  • 7.4 Fabrication of Device Structure
  • 7.5 Summary
  • 8. Chip Packaging
  • 8.1 The Storage Unit
  • 8.2 The Storage Module
  • 8.3 Limitations on Module Size
  • 8.4 Data Integrity
  • 8.5 Module Testing
  • 8.6 Summary
  • 9. Applications
  • 9.1 Useful Features of Bubble Devices
  • 9.2 General Purpose Storage Units
  • 9.3 Storage Hierarchies
  • 9.4 Special Purpose Applications
  • 9.5 Summary
  • 10. Future Prospects
  • 10.1 Dependencies of the Module Attributes
  • 10.2 Constraints on Active Chip Area
  • 10.3 Constraints on Device Cell Density
  • 10.4 Constraints on Operating Frequency
  • 10.5 Loop Length
  • 10.6 Areas for Future Research
  • 10.7 Summary
  • References.

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