Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics by Robert K. Brayton, Alberto L. Sangiovanni-Vincentelli.

This book was motivated by the problems being faced with shrinking IC process feature sizes. It is well known that as process feature sizes shrink, a host of electrical problems like cross-talk, electromigration, self-heat, etc. are becoming important. Cross-talk is one of the major problems since i...

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Bibliographic Details
Main Authors: Brayton, Robert K. (Author), Sangiovanni-Vincentelli, Alberto L. (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 2001.
Edition:1st ed. 2001.
Series:Springer eBook Collection.
Subjects:
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.

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505 0 |a 1. Introduction -- 1.1 Cross-talk in DSM IC Design -- 1.2 Book Overview -- 1.3 Book Outline -- 2. Validating Deep Sub-Micron Effects -- 2.1 Chapter Overview -- 2.2 Trends in DSM VLSI Interconnect -- 2.3 Predicting VLSI Process Technology Trends -- 2.4 Extracting On-chip Layout Parasitics -- 2.5 Validating Cross-talk Effects -- 2.6 Review of Existing Techniques -- 2.7 Chapter Summary -- 3. VLSI Layout Fabrics -- 3.1 Chapter Overview -- 3.2 Our Dense Wiring Fabric (DWF) -- 3.3 Advantages -- 3.4 Disadvantages -- 3.5 Chapter Summary -- 4. Fabric1 - Fabric Cell Based Design -- 4.1 Chapter Overview -- 4.2 Design Flow 1 -- 4.3 Design Flow 2 -- 4.4 Chapter Summary -- 5. Fabric3 - Network of PLA Based Design -- 5.1 Chapter Overview -- 5.2 Programmable Logic Arrays -- 5.3 Networks of Programmable Logic Arrays -- 5.4 Synthesis Algorithms for the Network of PLAs Methodology -- 5.5 Design Flow 1 -- 5.6 Design Flow 2 -- 5.7 Discussion -- 5.8 Chapter Summary -- 6. Wire Removal in a Network of PLAS -- 6.1 Chapter Overview -- 6.2 Binary SPFDs -- 6.3 MV-SPFDs -- 6.4 Experimental Results -- 6.5 Chapter Summary -- 7. Conclusions and Future Directions -- 7.1 Conclusions -- 7.2 Future Work -- Appendices -- Standard Cells. 
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