Digital CMOS Circuit Design by Silvia Annaratone.

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Bibliographic Details
Main Author: Annaratone, Silvia (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 1986.
Edition:1st ed. 1986.
Series:The Springer International Series in Engineering and Computer Science, 16
Springer eBook Collection.
Subjects:
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.
Table of Contents:
  • 1. Introduction
  • 1.1. From nMOS to CMOS
  • 1.2. CMOS Basic Gates
  • 2. MOS Transistor Characteristics
  • 2.1. The MOS Transistor
  • 2.2. Parasitic Parameters
  • 2.3. Small Geometry MOS Transistor
  • 2.4. CMOS Transmission Gate
  • 2.5. CMOS Inverter
  • 2.6. A More Accurate Model for the CMOS Inverter
  • 2.7. CMOS Power Dissipation
  • 3. Fabrication Processes
  • 3.1. The p-well Fabrication Process
  • 3.2. The n-well Fabrication Process
  • 3.3. LOCMOS Technology
  • 3.4. Latchup
  • 3.5. The Twin-tub Fabrication Process
  • 3.6. The SOS Fabrication Process
  • 3.7. Bulk vs. SOI
  • 3.8. Design Rules
  • 4. Logic Design
  • 4.1. Static Logic
  • 4.2. Dynamic Logic
  • 4.3. Charge Sharing
  • 4.4. Bootstrap Logic
  • 4.5. Logic Design at the System Level
  • 5. Circuit Design
  • 5.1. Resistance, Capacitance, and Inductance
  • 5.2. Modeling Long Interconnects
  • 5.3. The Concept of Equivalent Gate Load
  • 5.4. Delay Minimization
  • 5.5. Transistor Sizing in Static Logic
  • 5.6. Transistor Sizing in Dynamic Logic
  • 6. Design of Basic Circuits
  • 6.1. Storage Elements
  • 6.2. Full-adder
  • 6.3. Programmable Logic Array
  • 6.4. Random-access Memory
  • 6.5. Parallel Adder
  • 6.6. Parallel Multiplier
  • 7. Driver and I/O Buffer Design
  • 7.1. CMOS Inverter Delay Estimation
  • 7.2. Input Buffer
  • 7.3. Output Buffer
  • 7.4. Tri-state Output Buffer and I/O Buffer
  • 7.5. Output Buffer and Bus Driver Design Optimization
  • 7.6. Input Protection
  • 7.7. Output Protection
  • 7.8. Driving Large On-chip Loads
  • Appendix A. Layout
  • A. 1. General Considerations on Layout
  • A.2. Layout Methodologies for Latchup Avoidance
  • A.3. Layout with Structured Methodologies
  • A. 4. Power and Ground Routing
  • Appendix B. Interconnect Capacitance Computation
  • B. 1. Case 1: Coupled Microstrip Structure
  • B.2. Case 2: Coupled Stripline Structure
  • Appendix C. Figures from Section 5.4.2
  • Appendix D. Delay Minimization Based on Eq. (7-3)
  • Appendix E. Equations Related to Fig. 7-10
  • Appendix F. Symbols and Physical Constants.