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Digital CMOS Circuit Design
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Digital CMOS Circuit Design by Silvia Annaratone.
Saved in:
Bibliographic Details
Main Author:
Annaratone, Silvia
(Author)
Corporate Author:
SpringerLink (Online service)
Format:
eBook
Language:
English
Published:
New York, NY :
Springer US : Imprint: Springer,
1986.
Edition:
1st ed. 1986.
Series:
The Springer International Series in Engineering and Computer Science,
16
Springer eBook Collection.
Subjects:
Electrical engineering.
Electronic resources (E-books)
Online Access:
Click to view e-book
Holy Cross Note:
Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.
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Description
Table of Contents
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Table of Contents:
1. Introduction
1.1. From nMOS to CMOS
1.2. CMOS Basic Gates
2. MOS Transistor Characteristics
2.1. The MOS Transistor
2.2. Parasitic Parameters
2.3. Small Geometry MOS Transistor
2.4. CMOS Transmission Gate
2.5. CMOS Inverter
2.6. A More Accurate Model for the CMOS Inverter
2.7. CMOS Power Dissipation
3. Fabrication Processes
3.1. The p-well Fabrication Process
3.2. The n-well Fabrication Process
3.3. LOCMOS Technology
3.4. Latchup
3.5. The Twin-tub Fabrication Process
3.6. The SOS Fabrication Process
3.7. Bulk vs. SOI
3.8. Design Rules
4. Logic Design
4.1. Static Logic
4.2. Dynamic Logic
4.3. Charge Sharing
4.4. Bootstrap Logic
4.5. Logic Design at the System Level
5. Circuit Design
5.1. Resistance, Capacitance, and Inductance
5.2. Modeling Long Interconnects
5.3. The Concept of Equivalent Gate Load
5.4. Delay Minimization
5.5. Transistor Sizing in Static Logic
5.6. Transistor Sizing in Dynamic Logic
6. Design of Basic Circuits
6.1. Storage Elements
6.2. Full-adder
6.3. Programmable Logic Array
6.4. Random-access Memory
6.5. Parallel Adder
6.6. Parallel Multiplier
7. Driver and I/O Buffer Design
7.1. CMOS Inverter Delay Estimation
7.2. Input Buffer
7.3. Output Buffer
7.4. Tri-state Output Buffer and I/O Buffer
7.5. Output Buffer and Bus Driver Design Optimization
7.6. Input Protection
7.7. Output Protection
7.8. Driving Large On-chip Loads
Appendix A. Layout
A. 1. General Considerations on Layout
A.2. Layout Methodologies for Latchup Avoidance
A.3. Layout with Structured Methodologies
A. 4. Power and Ground Routing
Appendix B. Interconnect Capacitance Computation
B. 1. Case 1: Coupled Microstrip Structure
B.2. Case 2: Coupled Stripline Structure
Appendix C. Figures from Section 5.4.2
Appendix D. Delay Minimization Based on Eq. (7-3)
Appendix E. Equations Related to Fig. 7-10
Appendix F. Symbols and Physical Constants.
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