Nanopackaging Nanotechnologies and Electronics Packaging

Nanopackaging Nanotechnologies and Electronics Packaging / edited by James E. Morris.

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials ar...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Morris, James E. (Editor)
Format: eBook
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2018.
Edition:2nd ed. 2018.
Series:Springer eBook Collection.
Subjects:
Nanotechnology.
Electronics.
Microelectronics.
Electrochemistry.
Electronic resources (E-books)
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.
Table of Contents:
  • Nanopackaging: Nanotechnologies and Electronics Packaging
  • Modelling Technologies and Applications
  • Advances in Delamination Modeling: Continuum Aspects
  • Advances in Delamination Modeling: Atomistic Aspects
  • Soft Mold Nano-imprint: Modeling and Simulation
  • Nanoparticle Properties
  • Nanoparticle Fabrication
  • Nanoparticle-based High-k Dielectric Composites for Embedded Capacitors
  • Nanostructured Materials for Embedded Resistors
  • Nanogranular Magnetic Core Inductors: Design, Fabrication and Packaging
  • Nanoparticles in Isotropic Conductive Adhesives
  • Nano materials in Anisotropic Conductive Adhesives (ACAs)
  • Nanoparticles in Microvias
  • Silver Nanoparticles for Inkjet Printed Conductive Structures in Electronic Packaging
  • A Study of Nano Particles in SnAg-Based Lead Free Solders
  • Nano-Underfills for Fine Pitch Electronics
  • Carbon Nanotubes: Synthesis and Characterization
  • Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications
  • High Electromagnetic Shielding of Plastic Transceiver Packaging Using Dispersed Multiwall Carbon Nanotubes
  • Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced with Single-Wall Carbon Nanotubes
  • Carbon Nanotubes for Thermal Management of Microsystems
  • Nanowires in Electronics Packaging
  • Nanowire ACF for Ultrafine pitch Flip-Chip Interconnection
  • Synthesis and Optical Characterization of CVD Graphene
  • Characterization of electronic, electrical, optical and mechanical properties of grapheme
  • Graphene for Thermal Cooling of Microelectronics
  • Carbon Interconnects
  • Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging
  • Nanosensors for Electronics Package Reliability
  • Applications of Bio-Nanotechnology to Electronics Packaging
  • Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities
  • Nanotechnology Health, Safety, Environment Overview.

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