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20191027121600.0 |
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|a 9783319258928
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|a 10.1007/978-3-319-25892-8
|2 doi
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|a (DE-He213)978-3-319-25892-8
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1 |
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|a Arghode, Vaibhav K.
|e author.
|4 aut
|4 http://id.loc.gov/vocabulary/relators/aut
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| 245 |
1 |
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|a Air Flow Management in Raised Floor Data Centers
|h [electronic resource] /
|c by Vaibhav K. Arghode, Yogendra Joshi.
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| 250 |
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|a 1st ed. 2016.
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| 264 |
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1 |
|a Cham :
|b Springer International Publishing :
|b Imprint: Springer,
|c 2016.
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| 300 |
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|a XX, 72 p. 39 illus., 3 illus. in color.
|b online resource.
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| 336 |
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|a text
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| 490 |
1 |
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|a SpringerBriefs in Thermal Engineering and Applied Science,
|x 2193-2530
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| 490 |
1 |
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|a Springer eBook Collection
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| 505 |
0 |
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|a 1. Introduction -- 2. Metrology Tools -- 3. Cooling Air Delivery Through Perforated Tiles -- 4. Cold Aisle Containment -- 5. Other Air Delivery Schemes.
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| 520 |
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|a The Brief discuss primarily two aspects of air flow management in raised floor data centers. Firstly, cooling air delivery through perforated tiles will be examined and influence of the tile geometry on flow field development and hot air entrainment above perforated tiles will be discussed. Secondly, the use of cold aisle containment to physically separate hot and cold regions, and minimize hot and cold air mixing will be presented. Both experimental investigations and computational efforts are discussed and development of computational fluid dynamics (CFD) based models for simulating air flow in data centers is included. In addition, metrology tools for facility scale air velocity and temperature measurement, and air flow rate measurement through perforated floor tiles and server racks are examined and the authors present thermodynamics-based models to gauge the effectiveness and importance of air flow management schemes in data centers.
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| 590 |
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|a Loaded electronically.
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| 590 |
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|a Electronic access restricted to members of the Holy Cross Community.
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| 650 |
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|a Facility management.
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| 650 |
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|a Energy efficiency.
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| 650 |
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|a Thermodynamics.
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| 650 |
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|a Heat engineering.
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| 650 |
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|a Heat transfer.
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| 650 |
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|a Mass transfer.
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| 650 |
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|a Computer hardware.
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| 690 |
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|a Electronic resources (E-books)
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| 700 |
1 |
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|a Joshi, Yogendra.
|e author.
|4 aut
|4 http://id.loc.gov/vocabulary/relators/aut
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| 710 |
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|a SpringerBriefs in Thermal Engineering and Applied Science,
|x 2193-2530
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| 830 |
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|a Springer eBook Collection.
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| 856 |
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