Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms by Tim Kogel, Rainer Leupers, Heinrich Meyr.

We are presently observing a paradigm change in designing complex SoC as it occurs roughly every twelve years due to the exponentially increasing number of transistors on a chip. This design discontinuity, as all previous ones, is characterized by a move to a higher level of abstraction. This is req...

Full description

Saved in:
Bibliographic Details
Main Authors: Kogel, Tim (Author), Leupers, Rainer (Author), Meyr, Heinrich (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Dordrecht : Springer Netherlands : Imprint: Springer, 2006.
Edition:1st ed. 2006.
Series:Springer eBook Collection.
Subjects:
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.

MARC

LEADER 00000nam a22000005i 4500
001 b3310166
003 MWH
005 20191025032851.0
007 cr nn 008mamaa
008 100301s2006 ne | s |||| 0|eng d
020 |a 9781402048265 
024 7 |a 10.1007/1-4020-4826-2  |2 doi 
035 |a (DE-He213)978-1-4020-4826-5 
050 4 |a E-Book 
072 7 |a TJFC  |2 bicssc 
072 7 |a TEC008010  |2 bisacsh 
072 7 |a TJFC  |2 thema 
100 1 |a Kogel, Tim.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
245 1 0 |a Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms  |h [electronic resource] /  |c by Tim Kogel, Rainer Leupers, Heinrich Meyr. 
250 |a 1st ed. 2006. 
264 1 |a Dordrecht :  |b Springer Netherlands :  |b Imprint: Springer,  |c 2006. 
300 |a XIV, 186 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
490 1 |a Springer eBook Collection 
505 0 |a Foreword. Preface -- 1. Introduction -- 2. Embedded SOC Applications -- 3. Classification of Platform Elements -- 4. System Level Design Principles -- 5. Related Work -- 6. Methodology Overview -- 7. Unified Timing Model -- 8. MP-SOC Simulation Framework -- 9. Case Study -- 10. Summary -- Appendices. A: The OSCI TLM Standard. B: The OCPIP TL3 Channel. C: The Architects View Framework -- List of Figures. List of Tables. References -- Index. 
520 |a We are presently observing a paradigm change in designing complex SoC as it occurs roughly every twelve years due to the exponentially increasing number of transistors on a chip. This design discontinuity, as all previous ones, is characterized by a move to a higher level of abstraction. This is required to cope with the rapidly increasing design costs. While the present paradigm change shares the move to a higher level of abstraction with all previous ones, there exists also a key difference. For the ?rst time shrinking geometries do not leadtoacorrespondingincreaseofperformance. InarecenttalkLisaSuofIBM pointed out that in 65nm technology only about 25% of performance increase can be attributed to scaling geometries while the lion share is due to innovative processor architecture [1]. We believe that this fact will revolutionize the entire semiconductor industry. What is the reason for the end of the traditional view of Moore’s law? It is instructive to look at the major drivers of the semiconductor industry: wireless communications and multimedia. Both areas are characterized by a rapidly increasingdemandofcomputationalpowerinordertoprocessthesophisticated algorithmsnecessarytooptimallyutilizethepreciousresourcebandwidth. The computational power cannot be provided by traditional processor architectures and shared bus type of interconnects. The simple reason for this fact is energy ef?ciency: there exist orders of magnitude between the energy ef?ciency of an algorithm implemented as a ?xed functionality computational element and of a software implementation on a processor. 
590 |a Loaded electronically. 
590 |a Electronic access restricted to members of the Holy Cross Community. 
650 0 |a Electronic circuits. 
650 0 |a Software engineering. 
650 0 |a Electronics. 
650 0 |a Microelectronics. 
650 0 |a Computer simulation. 
650 0 |a Special purpose computers. 
650 0 |a Computer-aided engineering. 
690 |a Electronic resources (E-books) 
700 1 |a Leupers, Rainer.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
700 1 |a Meyr, Heinrich.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
830 0 |a Springer eBook Collection. 
856 4 0 |u https://holycross.idm.oclc.org/login?auth=cas&url=https://doi.org/10.1007/1-4020-4826-2  |3 Click to view e-book  |t 0 
907 |a .b33101668  |b 04-18-22  |c 02-26-20 
998 |a he  |b 02-26-20  |c m  |d @   |e -  |f eng  |g ne   |h 0  |i 1 
912 |a ZDB-2-ENG 
950 |a Engineering (Springer-11647) 
902 |a springer purchased ebooks 
903 |a SEB-COLL 
945 |f  - -   |g 1  |h 0  |j  - -   |k  - -   |l he   |o -  |p $0.00  |q -  |r -  |s b   |t 38  |u 0  |v 0  |w 0  |x 0  |y .i22233283  |z 02-26-20 
999 f f |i 2aef467b-bed7-577d-869b-375a905bee94  |s 6980b48a-1071-5139-ba55-cb27fd79ce52  |t 0 
952 f f |p Online  |a College of the Holy Cross  |b Main Campus  |c E-Resources  |d Online  |t 0  |e E-Book  |h Library of Congress classification  |i Elec File