Nano-Bio- Electronic, Photonic and MEMS Packaging

Nano-Bio- Electronic, Photonic and MEMS Packaging edited by C.P. Wong, Kyoung-Sik Moon, Yi (Grace) Li.

Nanotechnologies are frequently being applied to the biotechnology area, especially in nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials at the device level. Nano-Bio- Electronic, Photonic and MEMS Packaging discusses how nanofabrication...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Wong, C.P (Editor), Moon, Kyoung-Sik (Editor), Li, Yi (Grace) (Editor)
Format: eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 2010.
Edition:1st ed. 2010.
Series:Springer eBook Collection.
Subjects:
Nanotechnology.
Electrochemistry.
Electronics.
Microelectronics.
Biomedical engineering.
Biophysics.
Biological physics.
Electronic resources (E-books)
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.
Table of Contents:
  • Nanomaterials for Microelectronic and Bio-packaging
  • Nano-conductive Adhesives for Nano-electronics Interconnection
  • Biomimetic Lotus Effect Surfaces for Nanopackaging
  • Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials
  • Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications
  • 1D Nanowire Electrode Materials for Power Sources of Microelectronics
  • Mechanical Energy Harvesting Using Wurtzite Nanowires
  • Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging
  • to Nanoparticle-Based Integrated Passives
  • Thermally Conductive Nanocomposites
  • Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension
  • On-Chip Thermal Management and Hot-Spot Remediation
  • Some Aspects of Microchannel Heat Transfer
  • Nanoprobes for Live-Cell Gene Detection
  • Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips
  • Packaging of Biomolecular and Chemical Microsensors
  • Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging
  • Molecular Dynamics Applications in Packaging
  • Nanoscale Deformation and Strain Analysis by AFM/DIC Technique
  • Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.

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