Solder Joint Reliability Assessment Finite Element Simulation Methodology

Solder Joint Reliability Assessment Finite Element Simulation Methodology / by Mohd N. Tamin, Norhashimah M. Shaffiar.

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover...

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Bibliographic Details
Main Authors: Tamin, Mohd N. (Author), Shaffiar, Norhashimah M. (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2014.
Edition:1st ed. 2014.
Series:Advanced Structured Materials, 37
Springer eBook Collection.
Subjects:
Materials science.
Mechanics.
Mechanics, Applied.
Quality control.
Reliability.
Industrial safety.
Electronic resources (E-books)
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.
Table of Contents:
  • Introduction
  • Overview of the Simulation Methodology
  • Requirements for Finite Element Simulation
  • Mechanics of Solder Materials
  • Application I: Solder Joint Reflow Process
  • Application II: Solder Joints under Temperature and Mechanical Cycles
  • Damage Mechanics-based Models
  • Application III: Board-level Drop Test with BGA Package
  • Fatigue Fracture Process of Solder Joints
  • Closure.

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