|
|
|
|
LEADER |
00000cam a2200000Mi 4500 |
001 |
ocn742333202 |
003 |
OCoLC |
005 |
20240623213015.0 |
006 |
m o d |
007 |
cr |n|---||||| |
008 |
110725s2011 xx o 000 0 eng d |
040 |
|
|
|a EBLCP
|b eng
|e pn
|c EBLCP
|d OCLCQ
|d CDX
|d OCLCQ
|d OCLCO
|d OCLCQ
|d DEBSZ
|d IDEBK
|d YDXCP
|d DEBBG
|d OCLCQ
|d ZCU
|d OCLCQ
|d MERUC
|d OCLCQ
|d OCLCA
|d OCLCF
|d ICG
|d OCLCQ
|d UMR
|d DKC
|d OCLCQ
|d OCLCO
|d OCLCQ
|d OCLCO
|d OCLCL
|
019 |
|
|
|a 778620984
|a 816882811
|
020 |
|
|
|a 9781119990109
|
020 |
|
|
|a 1119990106
|
035 |
|
|
|a (OCoLC)742333202
|z (OCoLC)778620984
|z (OCoLC)816882811
|
050 |
|
4 |
|a TK7870.23.B395 2011
|
049 |
|
|
|a HCDD
|
100 |
1 |
|
|a Bâzu, M. I.
|q (Marius I.),
|d 1948-
|1 https://id.oclc.org/worldcat/entity/E39PCjDgrRM3BpPPfCTF9tqFw3
|
245 |
1 |
0 |
|a Failure Analysis :
|b a Practical Guide for Manufacturers of Electronic Components and Systems.
|
260 |
|
|
|a Hoboken :
|b John Wiley & Sons,
|c 2011.
|
300 |
|
|
|a 1 online resource (815 pages)
|
336 |
|
|
|a text
|b txt
|2 rdacontent
|
337 |
|
|
|a computer
|b c
|2 rdamedia
|
338 |
|
|
|a online resource
|b cr
|2 rdacarrier
|
505 |
0 |
|
|a Cover; Series Page; Title Page; Copyright; Dedication; Series Editor's Foreword; Foreword by Dr Craig Hillman; Series Editor's Preface; Preface; About the Authors; Chapter 1: Introduction; Chapter 2: Failure Analysis--Why?; Chapter 3: Failure Analysis--When?; Chapter 4: Failure Analysis--How?; Chapter 5: Failure Analysis--What?; Chapter 6: Case Studies; Chapter 7: Conclusions; Acronyms; Glossary; Index.
|
520 |
|
|
|a Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need p.
|
588 |
0 |
|
|a Print version record.
|
650 |
|
0 |
|a Electronic apparatus and appliances
|x Reliability.
|
650 |
|
0 |
|a Electronic systems
|x Testing.
|
650 |
|
0 |
|a System failures (Engineering)
|x Prevention.
|
650 |
|
7 |
|a Electronic apparatus and appliances
|x Reliability
|2 fast
|
650 |
|
7 |
|a Electronic systems
|x Testing
|2 fast
|
700 |
1 |
|
|a Băjenescu, Titu I.,
|d 1938-
|1 https://id.oclc.org/worldcat/entity/E39PCjtdFdqtk4jWxgkWfBGgVd
|
758 |
|
|
|i has work:
|a Failure analysis (Text)
|1 https://id.oclc.org/worldcat/entity/E39PCGM84k3p4343mvCjjr8KVC
|4 https://id.oclc.org/worldcat/ontology/hasWork
|
776 |
0 |
8 |
|i Print version:
|a Bazu, Marius.
|t Failure Analysis : A Practical Guide for Manufacturers of Electronic Components and Systems.
|d Hoboken : John Wiley & Sons, Ltd., ©2011
|z 9780470748244
|
856 |
4 |
0 |
|u https://ebookcentral.proquest.com/lib/holycrosscollege-ebooks/detail.action?docID=675196
|y Click for online access
|
903 |
|
|
|a EBC-AC
|
994 |
|
|
|a 92
|b HCD
|