Adhesion in microelectronics

Adhesion in microelectronics / edited by K.L. Mittal and Tanweer Ahsan.

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Podrobná bibliografie
Další autoři: Mittal, K. L., 1945-, Ahsan, Tanweer
Médium: E-kniha
Jazyk:English
Vydáno: Hoboken, New Jersey : John Wiley and Sons, Inc., [2014]
Edice:Adhesion and adhesives. Fundamental and applied aspects.
Témata:
Microelectronic packaging > Materials.
Adhesives.
Adhesive joints.
adhesive.
TECHNOLOGY & ENGINEERING > Mechanical.
Adhesive joints
Adhesives
Microelectronic packaging > Materials
On-line přístup:Click for online access
Popis
Shrnutí:In a single and easily accessible source, this comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics. --
Fyzický popis:1 online resource
Bibliografie:Includes bibliographical references and index.
ISBN:9781118831342
1118831349
9781118831359
1118831357
9781118831373
1118831373
1118831330
9781118831335
Source of Description, Etc. Note:Print version record and CIP data provided by publisher.

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