Adhesion in microelectronics

Adhesion in microelectronics / edited by K.L. Mittal and Tanweer Ahsan.

In a single and easily accessible source, this comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics. --

Збережено в:

Бібліографічні деталі
Інші автори:	Mittal, K. L., 1945-, Ahsan, Tanweer
Формат:	eКнига
Мова:	English
Опубліковано:	Hoboken, New Jersey : John Wiley and Sons, Inc., [2014]
Серія:	Adhesion and adhesives. Fundamental and applied aspects.
Предмети:	Microelectronic packaging > Materials. Adhesives. Adhesive joints. adhesive. TECHNOLOGY & ENGINEERING > Mechanical. Adhesive joints Adhesives Microelectronic packaging > Materials
Онлайн доступ:	Click for online access

Опис
Резюме:	In a single and easily accessible source, this comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics. --
Фізичний опис:	1 online resource
Бібліографія:	Includes bibliographical references and index.
ISBN:	9781118831342 1118831349 9781118831359 1118831357 9781118831373 1118831373 1118831330 9781118831335
Source of Description, Etc. Note:	Print version record and CIP data provided by publisher.