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20240909213021.0 |
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140805s2014 nju ob 001 0 eng |
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|a 2014031115
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|a DLC
|b eng
|e rda
|e pn
|c DLC
|d EBLCP
|d N$T
|d YDXCP
|d DG1
|d E7B
|d VRC
|d OCLCF
|d RECBK
|d OCLCO
|d DEBSZ
|d COO
|d OCLCO
|d DEBBG
|d COCUF
|d DG1
|d CCO
|d LIP
|d PIFAG
|d ZCU
|d UAB
|d MERUC
|d K6U
|d OCLCQ
|d U3W
|d D6H
|d OCLCQ
|d STF
|d CEF
|d NRAMU
|d CRU
|d ICG
|d VTS
|d OCLCQ
|d INT
|d OCLCQ
|d TKN
|d OCLCQ
|d DKC
|d OCLCQ
|d OCLCA
|d S9I
|d OCLCQ
|d EYM
|d OCLCO
|d OCLCQ
|d OCLCO
|d OCLCL
|d UEJ
|d OCLCQ
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|a 961660673
|a 962720608
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|a 9781118831342
|q (epub)
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|a 1118831349
|q (epub)
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|a 9781118831359
|q (pdf)
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|a 1118831357
|q (pdf)
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|a 9781118831373
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|a 1118831373
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|a 1118831330
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|a 9781118831335
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|z 9781118831335
|q (cloth ;
|q alk. paper)
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|a (OCoLC)885378211
|z (OCoLC)961660673
|z (OCoLC)962720608
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|a pcc
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0 |
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|a TK7870.15
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|a TEC
|x 009070
|2 bisacsh
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| 049 |
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|a HCDD
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| 245 |
0 |
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|a Adhesion in microelectronics /
|c edited by K.L. Mittal and Tanweer Ahsan.
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1 |
|a Hoboken, New Jersey :
|b John Wiley and Sons, Inc.,
|c [2014]
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| 264 |
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4 |
|c ©2014
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|a 1 online resource
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 490 |
1 |
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|a Adhesion and Adhesives: Fundamental and Applied Aspects
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| 504 |
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|a Includes bibliographical references and index.
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0 |
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|a Print version record and CIP data provided by publisher.
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|a In a single and easily accessible source, this comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics. --
|c Edited summary from book.
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0 |
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|a Half Title page; Title page; Copyright page; Preface; Acknowledgements; Part 1: Adhesion: Fundamentals and Measurement; Chapter 1: Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics; 1.1 Introduction; 1.2 Principles of IETS; 1.3 Application of IETS in Microelectronics; 1.4 Prospects; 1.5 Summary; References; Chapter 2: Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics.; 2.1. Introduction; 2.2 Mechanical Methods; 2.3 Laser Based Techniques; 2.4 Summary and Remarks; References.
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| 505 |
8 |
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|a Part 2: Ways to Promote/Enhance AdhesionChapter 3: Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion; 3.1 Introduction; 3.2 New Concepts for Ideal Design of Metal-Polymer Interfaces with Covalently Bonded Flexible Spacer Molecules; 3.3 Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate; 3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin Surfaces; 3.5 Methods for Producing Monosort Functional Groups at Polyolefin Surfaces; 3.6 Reactions and Bond Formation at the Interface; 3.7 Grafting of Spacer Molecules at Polyolefin Surfaces.
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| 505 |
8 |
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|a 3.8 Summary and ConclusionsAcknowledgement; References; Chapter 4: Atmospheric and Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in Microelectronics Packaging; 4.1 Introduction; 4.2 Plasma Fundamentals; 4.3 Survey of Vacuum Plasma Treatment of Polymers; 4.4 Survey of Atmospheric Pressure Plasma Treatment of Polymers; 4.5 Atmospheric Pressure Plasma Activation of Polymer Materials Relevant to Microelectronics; 4.6 Vacuum Versus Atmospheric Plasmas for Use in Semiconductor Packaging; References.
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| 505 |
8 |
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|a Chapter 5: Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications5.1 Introduction; 5.2 ICA Technology; 5.3 Technology Reviews; 5.4 Electrical Properties; 5.5 Mechanical Properties; 5.6 Thermal Properties; 5.7 Metallic Filler; 5.8 Polymer Materials; 5.9 Reliability; 5.10 Dispensation; 5.11 Environmental Properties; 5.12 Other Results; 5.13 Summary; 5.14 Prospects; References; Part 3: Reliability and Failure Mechanisms; Chapter 6: Role of Adhesion Phenomenon in the Reliability of Electronic Packaging; 6.1 Introduction; 6.2 Hierarchy of Electronic Packaging.
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|a 6.3 Substrates, Carriers, and Laminates6.4 Flexible Laminates; 6.5 First Level Packaging /Semiconductor Packaging; 6.6 Second Level Packaging; 6.7 Reliability Enhancements; 6.8 Thermal Management; 6.9 Summary; Acknowledgements; References; Chapter 7: Delamination and Reliability Issues in Packaged Devices; 7.1 Introduction; 7.2 Basic Aspects of Delamination Failure; 7.3 Evaluation of Delamination Initiation in Electronic Packages; 7.4 Evaluation of Delamination Propagation in Electronic Packages; 7.5 Summary; References.
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| 650 |
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|a Microelectronic packaging
|x Materials.
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| 650 |
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|a Adhesives.
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| 650 |
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0 |
|a Adhesive joints.
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| 650 |
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7 |
|a adhesive.
|2 aat
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| 650 |
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|a TECHNOLOGY & ENGINEERING
|x Mechanical.
|2 bisacsh
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| 650 |
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7 |
|a Adhesive joints
|2 fast
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| 650 |
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7 |
|a Adhesives
|2 fast
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| 650 |
|
7 |
|a Microelectronic packaging
|x Materials
|2 fast
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| 700 |
1 |
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|a Mittal, K. L.,
|d 1945-
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| 700 |
1 |
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|a Ahsan, Tanweer.
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| 758 |
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|i has work:
|a Adhesion in microelectronics (Text)
|1 https://id.oclc.org/worldcat/entity/E39PCGwcFvXpdwQWfVJFQxq6yq
|4 https://id.oclc.org/worldcat/ontology/hasWork
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| 776 |
0 |
8 |
|i Print version:
|t Adhesion in microelectronics.
|d Hoboken, New Jersey : John Wiley and Sons, Inc., [2014]
|z 9781118831335
|w (DLC) 2014029765
|
| 830 |
|
0 |
|a Adhesion and adhesives.
|p Fundamental and applied aspects.
|
| 856 |
4 |
0 |
|u https://ebookcentral.proquest.com/lib/holycrosscollege-ebooks/detail.action?docID=1767917
|y Click for online access
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| 903 |
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|a EBC-AC
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| 994 |
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|a 92
|b HCD
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