Materials and failures in MEMS and NEMS

Materials and failures in MEMS and NEMS / edited by Atul Tiwari and Baldev Raj.

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Bibliographic Details
Other Authors: Tiwari, Atul (Editor), Raj, Baldev, 1947-2018 (Editor)
Format: eBook
Language:English
Published: Hoboken, New Jersey : Salem, Massachusetts : John Wiley & Sons ; Scrivener Publishing, 2015.
Series:Materials degradation and failures series
Subjects:
Microelectromechanical systems > Design and construction.
Nanoelectromechanical systems > Design and construction.
TECHNOLOGY & ENGINEERING > Mechanical.
Microelectromechanical systems > Design and construction
Online Access:Click for online access
Table of Contents:
  • Half Title page
  • Title page
  • Copyright page
  • Preface
  • Chapter 1: Carbon as a MEMS Material
  • 1.1 Introduction
  • 1.2 Structure and Properties of Glassy Carbon
  • 1.3 Fabrication of C-MEMS Structures
  • 1.4 Integration of C-MEMS Structures with Other Materials
  • 1.5 Conclusion
  • References
  • Chapter 2: Intelligent Model-Based Fault Diagnosis of MEMS
  • 2.1 Introduction
  • 2.2 Model-Based Fault Diagnosis
  • 2.3 Self-Tuning Estimation
  • References
  • Chapter 3: MEMS Heat Exchangers
  • 3.1 Introduction
  • 3.2 Fundamentals of Thermodynamics, Fluid Mechanics, and Heat Transfer3.3 MEMS Heat Sinks
  • 3.4 MEMS Heat Pipes
  • 3.5 Two-Fluid MEMS Heat Exchanger
  • 3.6 Need for Microscale Internal Flow Passages
  • Nomenclature
  • Greek Alphabets
  • Subscripts
  • References
  • Chapter 4: Application of Porous Silicon in MEMS and Sensors Technology
  • 4.1 Introduction
  • 4.2 Porous Silicon in Biosensors
  • 4.3 Porous Silicon for Pressure Sensors
  • 4.4 Conclusion
  • References
  • Chapter 5: MEMS/NEMS Switches with Silicon to Silicon (Si-to-Si) Contact Interface
  • 5.1 Introduction5.2 Bi-Stable CMOS Front End Silicon Nanofin (SiNF) Switch for Non-volatile Memory Based On Van Der Waals Force
  • 5.3 Vertically Actuated U-Shape Nanowire NEMS Switch
  • 5.4 A Vacuum Encapsulated Si-to-Si MEMS Switch for Rugged Electronics
  • 5.5 Summary
  • References
  • Chapter 6: On the Design, Fabrication, and Characterization of cMUT Devices
  • 6.1 Introduction
  • 6.2 cMUT Design and Finite Element Modeling Simulation
  • 6.3 cMUT Fabrication and Characterization
  • 6.4 Summary and Conclusions
  • Acknowledgments
  • References
  • Chapter 7: Inverse Problems in the MEMS/NEMS Applications7.1 Introduction
  • 7.2 Inverse Problems in the Micro/Nanomechanical Resonators
  • 7.3 Inverse Problems in the MEMS Stiction Test
  • Acknowledgment
  • References
  • Chapter 8: Ohmic RF-MEMS Control
  • 8.1 Introduction
  • 8.2 Charge Drive Control (Resistive Damping)
  • 8.3 Hybrid Drive Control
  • 8.4 Control Under High-Pressure Gas Damping
  • 8.5 Comparison between Different Control Modes
  • References
  • Chapter 9: Dynamics of MEMS Devices
  • 9.1 Introduction
  • 9.2 Modeling and Simulation
  • 9.3 Fabrication Methods9.4 Characterization
  • 9.5 Device Failures
  • Acknowledgments
  • References
  • Chapter 10: Buckling Behaviors and Interfacial Toughness of a Micron-Scale Composite Structure with a Metal Wire on a Flexible Substrate
  • 10.1 Introduction
  • 10.2 Buckling Behaviors of Constantan Wire under Electrical Loading
  • 10.3 Interfacial Toughness between Constantan Wire and Polymer Substrate
  • 10.4 Buckling Behaviors of Polymer Substrate Restricted by Constantan Wire
  • 10.5 Conclusions
  • Acknowledgments
  • References

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