Beam Technologies for Integrated Processing.

Beam Technologies for Integrated Processing.

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Bibliographic Details
Main Author: Staff, National Research Council
Format: eBook
Language:English
Published: Washington : National Academies Press, 1900.
Subjects:
Microelectronics industry.
Molecular beams > Industrial applications.
Microelectronics > Materials.
Plasma-enhanced chemical vapor deposition > Industrial applications.
Microelectronics industry
Microelectronics > Materials
Molecular beams > Industrial applications
Plasma-enhanced chemical vapor deposition > Industrial applications
Online Access:Click for online access
Table of Contents:
  • ""BEAM TECHNOLOGIES FOR INTEGRATED PROCESSING""; ""Copyright""; ""ABSTRACT""; ""PREFACE""; ""ACKNOWLEDGMENTS""; ""Contents""; ""1 Introduction ""; ""2 SUMMARY AND RECOMMENDATIONS ""; ""SUMMARY""; ""Electronic Materials""; ""Engineered Materials""; ""Integrated Processing""; ""RECOMMENDATIONS""; ""3 BEAM TECHNOLOGIES ""; ""ATOMIC AND MOLECULAR MATERIAL BEAMS""; ""Physical Vapor Deposition""; ""Direct Evaporation Processes""; ""Direct Reactive Evaporation Processes""; ""Direct Sputtering Processes""; ""Reactive Sputtering Processes""; ""Ion Beam Sputtering Processes""
  • ""Molecular Beam Epitaxy""""Chemical Vapor Deposition Processes""; ""Microwave Electron Cyclotron Resonance Plasmas""; ""Ion Beams""; ""Energy Beams""; ""Laser Beams""; ""Electron Beams""; ""X-Ray Lithography""; ""Microwave Beams""; ""REFERENCES""; ""4 BEAM APPLICATIONS IN MICROELECTRONICS ""; ""BEAM APPLICATIONS IN SEMICONDUCTOR DEVICE MANUFACTURE""; ""Silicon Integrated Circuits""; ""Beam Technologies For Materials Deposition""; ""Beam Technologies For Patterning""; ""Beam Technologies For Etching""; ""BEAM TECHNOLOGIES FOR COMPOUND SEMICONDUCTOR ICS""
  • ""Beam Technologies For Materials Deposition""""Beam Technologies For Heating""; ""OPTOELECTRONICS""; ""REFERENCES""; ""5 BEAM APPLICATIONS IN ENGINEERED MATERIALS""; ""COATINGS""; ""Diamond, Diamond-Like Carbon, And Cubic Boron Nitride Coatings""; ""SURFACE MODIFICATION""; ""APPLICATIONS OF LASERS TO MATERIALS FORMING""; ""Shaping And Removal""; ""Desktop Deposition""; ""Joining""; ""POWDER PREPARATION""; ""COMPOSITES FABRICATION""; ""Fiber And Whisker Preparation""; ""Metal-Matrix Composites Fabrication""; ""Ceramic-Matrix Composites Fabrication""; ""NANOPHASE MATERIALS""
  • ""OPTICAL SURFACES AND DEVICES""""POLYMERS""; ""MATERIALS FOR ENERGY PRODUCTION""; ""BIOIMPLANT DEVICES""; ""REFERENCES""; ""6 INTEGRATED PROCESSING ""; ""INTEGRATED PROCESSING IN MICROELECTRONICS""; ""Integrated Processing For Integrated Circuits""; ""Traditional Integrated Circuit Processing Techniques""; ""Advances Toward Integrated Processing""; ""Integrated Processing Tools""; ""Applications For Integrated Processing Tools""; ""INTEGRATED PROCESSING FOR METALS AND CERAMICS""; ""Architectural Glass Coatings""; ""In-Line Dry Coating Process For Stainless Steel Sheet""
  • ""Mechanical Fabrication""""REFERENCES""; ""7 REQUIREMENTS AND PROBLEMS FOR FURTHER INTEGRATION ""; ""REFERENCE""; ""APPENDIX A ACRONYMS AND ABBREVIATIONS""; ""APPENDIX B BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS ""

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