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151010s1997 dcu o 000 0 eng d |
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|a EBLCP
|b eng
|e pn
|c EBLCP
|d OCLCQ
|d MERUC
|d OCLCQ
|d S4S
|d COO
|d XFH
|d ZCU
|d ICG
|d OCLCO
|d OCLCF
|d VT2
|d OCLCQ
|d OCLCO
|d WYU
|d OCLCQ
|d DKC
|d OCLCQ
|d OCLCO
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|d OCLCO
|d OCLCL
|d OCLCQ
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|a 697727824
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|a 9780309591515
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|a 0309591511
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|a 9780309059800
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|a 0309059801
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|a (OCoLC)923260667
|z (OCoLC)697727824
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| 037 |
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|b 00017961
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4 |
|a TK7874.N333 1997eb
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| 049 |
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|a HCDD
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| 100 |
1 |
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|a Staff, National Research Council.
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| 245 |
1 |
0 |
|a Microelectromechanical Systems :
|b Advanced Materials and Fabrication Methods.
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| 260 |
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|a Washington :
|b National Academies Press,
|c 1997.
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| 300 |
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|a 1 online resource (76 pages)
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 588 |
0 |
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|a Print version record.
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| 505 |
0 |
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|a ""Microelectromechanical Systems""; ""Copyright""; ""Acknowledgments""; ""Preface""; ""Contents""; ""Acronyms""; ""Executive Summary""; ""LEVERAGING AND EXTENDING THE INTEGRATED CIRCUITS FOUNDATION""; ""ENLARGING THE SUITE OF MATERIALS SUITABLE FOR INTEGRATED-CIRCUIT-LIKE PROCESSING""; ""CHARACTERIZING MEMS MATERIALS""; ""UNDERSTANDING SURFACE AND INTERFACE EFFECTS""; ""ETCHING TECHNOLOGIES""; ""ESTABLISHING STANDARD TEST DEVICES AND METHODS""; ""MEMS PACKAGING""; ""FOUNDRY AND COMPUTER-AIDED DESIGN INFRASTRUCTURE FOR MEMS""; ""ACADEMIC STRUCTURE TO SUPPORT MEMS""; ""1 Background""
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| 505 |
8 |
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|a ""COMMERCIAL SUCCESSES""""Thermal Ink-Jet Printing""; ""Accelerometers""; ""NEWLY INTRODUCED PRODUCTS""; ""High-Resolution Displays""; ""Chemical-Sensing Arrays""; ""LONGER-RANGE OPPORTUNITIES""; ""Transportation""; ""Biomedical and Health Care""; ""Information Technology""; ""Defense""; ""SUMMARY""; ""2 Integrated Circuit-Based Fabrication Technologies and Materials""; ""STRENGTHS OF THE INTEGRATED CIRCUIT PROCESS""; ""USING EXISTING INTEGRATED CIRCUIT-BASED PROCESSES""; ""Bulk Micromachining Processes""; ""Bulk Micromachining for MEMS with Electronics""; ""Surface Micromachining Processes""
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| 505 |
8 |
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|a ""Surface Micromachining to Produce Multilevel MEMS""""CLASSIFYING INTEGRATED CIRCUIT-BASED TECHNOLOGIES""; ""MEMS with Old Materials and Old Tools""; ""MEMS with Old Materials and New Tools""; ""MEMS with New Materials and Old Tools""; ""MEMS with New Materials and New Tools""; ""SUMMARY""; ""3 New Materials and Processes""; ""MOTIVATIONS FOR NEW TECHNOLOGIES""; ""MATERIALS AND PROCESSES FOR HIGH-ASPECT-RATIO STRUCTURES""; ""HEXSIL""; ""LIGA""; ""Compatibility and Manufacturing Constraints of LIGA""; ""MATERIALS AND PROCESSES FOR ENHANCED-FORCE MICROACTUATION""; ""Materials""
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| 505 |
8 |
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|a ""Magnetic Thin-Films""""Piezoelectric Films""; ""Shape-Memory Alloys""; ""Shape-Memory Polymers""; ""Magnetostrictive Alloys""; ""Processing""; ""Processing Multilayer Ceramics""; ""Thin-Film Processing""; ""FILMS FOR USE IN SEVERE ENVIRONMENTS: SILICON CARBIDE AND DIAMOND""; ""Silicon Carbide""; ""Diamond""; ""SURFACE MODIFICATIONS/COATINGS""; ""Plasma-Deposited Polymers""; ""Polyimides""; ""Conducting Polymers""; ""POWER SUPPLIES""; ""SUMMARY""; ""4 Designing Microelectromechanical Systems ""; ""METROLOGY""; ""MODELING""; ""COMPUTER-AIDED DESIGN SYSTEMS""; ""FOUNDRY INFRASTRUCTURE""
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| 505 |
8 |
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|a ""SUMMARY""""5 Assembly, Packaging, and Testing""; ""CONTRASTS BETWEEN ASSEMBLY, PACKAGING, AND TESTING OF INTEGRATED CIRCUITS AND MICROELECTROMECHANICAL ... ""; ""INTERFACES""; ""Biomedical Interfaces""; ""Optical Interfaces""; ""Electrical Power""; ""Fluidics""; ""Mechanical Interfaces""; ""PACKAGING""; ""Handling Issues""; ""Dicing""; ""Cleanliness""; ""Stiction""; ""Packaging Materials""; ""Stresses on Packaging""; ""Fluid Environment""; ""Vacuum Packaging""; ""ASSEMBLY""; ""Hybrid Assembly""; ""Assembly of Micromechanical Parts""; ""STANDARDS, TESTING, AND RELIABILITY""
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| 500 |
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|a ""Failure analysis""
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| 650 |
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0 |
|a Microelectronics
|x Materials.
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| 650 |
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0 |
|a Microelectromechanical systems
|x Design and construction.
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| 650 |
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7 |
|a Microelectromechanical systems
|x Design and construction
|2 fast
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| 650 |
|
7 |
|a Microelectronics
|x Materials
|2 fast
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| 758 |
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|i has work:
|a Microelectromechanical Systems: Advanced Materials and Fabrication Methods (Text)
|1 https://id.oclc.org/worldcat/entity/E39PCYvMd4RxwcbqCWFGWYhVwd
|4 https://id.oclc.org/worldcat/ontology/hasWork
|
| 776 |
0 |
8 |
|i Print version:
|a Staff, National Research Council.
|t Microelectromechanical Systems : Advanced Materials and Fabrication Methods.
|d Washington : National Academies Press, ©1900
|z 9780309059800
|
| 856 |
4 |
0 |
|u https://ebookcentral.proquest.com/lib/holycrosscollege-ebooks/detail.action?docID=3376045
|y Click for online access
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| 903 |
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|a EBC-AC
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| 994 |
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|a 92
|b HCD
|