|
|
|
|
| LEADER |
00000cam a2200000 i 4500 |
| 001 |
ocn935229360 |
| 003 |
OCoLC |
| 005 |
20240809213013.0 |
| 006 |
m o d |
| 007 |
cr |n||||||||| |
| 008 |
160123s2003 ne o 000 0 eng d |
| 040 |
|
|
|a EBLCP
|b eng
|e pn
|c EBLCP
|d OCLCQ
|d MERUC
|d ZCU
|d ICG
|d OCLCO
|d OCLCF
|d OCLCQ
|d OCLCO
|d OCLCQ
|d DKC
|d OCLCQ
|d OCLCO
|d OCLCQ
|d OCLCO
|d OCLCL
|d OCLCQ
|
| 020 |
|
|
|a 9789047403333
|
| 020 |
|
|
|a 9047403339
|
| 035 |
|
|
|a (OCoLC)935229360
|
| 050 |
|
4 |
|a TA418.78
|b I565 2003eb
|
| 049 |
|
|
|a HCDD
|
| 100 |
1 |
|
|a Mittal, K. L.
|
| 245 |
1 |
0 |
|a Particles on surfaces 8 :
|b Detection, adhesion and removal.
|
| 260 |
|
|
|a Leiden :
|b BRILL,
|c 2003.
|
| 300 |
|
|
|a 1 online resource (361 pages)
|
| 336 |
|
|
|a text
|b txt
|2 rdacontent
|
| 337 |
|
|
|a computer
|b c
|2 rdamedia
|
| 338 |
|
|
|a online resource
|b cr
|2 rdacarrier
|
| 588 |
0 |
|
|a Print version record.
|
| 505 |
0 |
|
|a Preface; Part 1: Particle Analysis / Characterization and General Cleaning-Related Topics; The nature and characterization of small particles; Surface and micro-analytical methods for particle identification; The haze of a wafer: A new approach to monitor nano-sized particles; Particle transport and adhesion in an ultra-clean ion-beam sputter deposition process; Particle deposition from a carry-over layer during immersion rinsing; The use of surfactants to reduce particulate contamination on surfaces; The use of rectangular jets for surface decontamination.
|
| 505 |
8 |
|
|a Ice-air blast cleaning: Case studiesDevelopment of a technique for glass cleaning in the course of demanufacturing of electronic products; Part 2: Particle Adhesion and Removal; Mechanics of nanoparticle adhesion -- A continuum approach; A new thermodynamic theory of adhesion of particles on surfaces; Particle adhesion on nanoscale rough surfaces; Advanced wet cleaning of sub-micrometer sized particles; Modified SC-1 solutions for silicon wafer cleaning; Investigation of ozonated DI water in semiconductor wafer cleaning; Possible post-CMP cleaning processes for STI ceria slurries.
|
| 505 |
8 |
|
|a The ideal ultrasonic parameters for delicate parts cleaningEffects of megasonics coupled with SC-1 process parameters on particle removal on 300-mm silicon wafers; Influences of various parameters on microparticles removal during laser surface cleaning; Particle removal with pulsed-laser induced plasma over an extended area of a silicon wafer; Particle removal by collisions with energetic clusters.
|
| 520 |
|
|
|a This work documents the proceedings of the 8th International Symposium on Particles on Surfaces - Detection, Adhesion and Removal, held in Providence, Rhode Island, from June 24-26, 2002. Topics include nature and characterization of small particles, and particle deposition during immersion rinsing.
|
| 650 |
|
0 |
|a Particles
|v Congresses.
|
| 650 |
|
0 |
|a Surfaces (Technology)
|v Congresses.
|
| 650 |
|
7 |
|a Particles
|2 fast
|
| 650 |
|
7 |
|a Surfaces (Technology)
|2 fast
|
| 655 |
|
7 |
|a Conference papers and proceedings
|2 fast
|
| 700 |
1 |
|
|a Mittal, K. L.
|
| 758 |
|
|
|i has work:
|a Particles on surfaces 8 (Text)
|1 https://id.oclc.org/worldcat/entity/E39PCG9Q8TPBtC6kcywXjYh9ym
|4 https://id.oclc.org/worldcat/ontology/hasWork
|
| 776 |
0 |
8 |
|i Print version:
|a Mittal, K.L.
|t Particles on surfaces 8 : Detection, adhesion and removal.
|d Leiden : BRILL, ©2003
|z 9789067643924
|
| 856 |
4 |
0 |
|u https://ebookcentral.proquest.com/lib/holycrosscollege-ebooks/detail.action?docID=253651
|y Click for online access
|
| 903 |
|
|
|a EBC-AC
|
| 994 |
|
|
|a 92
|b HCD
|