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20240623213015.0 |
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|a 1000152613
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|q (electronic book)
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|a 1119045991
|q (electronic book)
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|q (hardcover)
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|z (OCoLC)1000152613
|z (OCoLC)1021819429
|z (OCoLC)1237222747
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|a 9781119046004
|b Wiley
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4 |
|a TK7874
|b .L437 2017
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| 072 |
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|a TEC
|x 009070
|2 bisacsh
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| 049 |
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|a HCDD
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| 100 |
1 |
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|a Li, Suny,
|d 1974-
|1 https://id.oclc.org/worldcat/entity/E39PCjwV4RkgkWmqXhWFkfgVG3
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| 245 |
1 |
0 |
|a SiP-System in Package Design and Simulation :
|b Mentor EE Flow Advanced Design Guide.
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| 260 |
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|a Newark :
|b John Wiley & Sons, Incorporated,
|c 2017.
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| 300 |
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|a 1 online resource (506 pages)
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 347 |
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|a data file
|2 rda
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| 588 |
0 |
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|a Print version record.
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| 505 |
0 |
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|a Cover; Title Page; Copyright; Contents; About the Author; Preface; Chapter 1 SiP Design and Simulation Platform; 1.1 From package to SiP; 1.2 The development of mentor SiP design technology; 1.3 The mentor SiP design and simulation platform; 1.3.1 SiP platform introduction; 1.3.2 Schematic input; 1.3.3 Concurrent system design; 1.3.4 SiP board design; 1.3.5 Signal integrity and power integrity simulation; 1.3.6 Thermal analysis; 1.3.7 The advantages of the mentor SiP design and simulation platform; 1.3.7.1 Characteristics of mentor SiP design and simulation platform.
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|a 1.3.7.2 Design areas of mentor SiP design and simulation platform1.4 The introduction of the finished project; Chapter 2 Introduction to Package; 2.1 Definition and function of package; 2.2 Development of packaging technology; 2.3 SiP and Related Technologies; 2.3.1 The appearance of SiP technology; 2.3.2 SoC and SiP; 2.3.3 SiP-related technologies; 2.4 The development of the package market; 2.5 Package manufacturers; 2.5.1 Traditional package manufacturers; 2.5.2 New SiP manufacturers in different areas; 2.6 Bare chip suppliers; Chapter 3 The SiP Production Process.
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|a 3.1 BGA: The mainstream SiP package form3.2 The SiP package production process; 3.3 Three key elements of SiP; Chapter 4 New Package Technologies; 4.1 TSV (Through Silicon Via) technology; 4.1.1 TSV introduction; 4.1.2 TSV technical characteristics; 4.1.3 TSV application and prospects; 4.2 Integrated passive device (IPD) technology; 4.2.1 IPD introduction; 4.2.2 The advantages of IPD; 4.3 Package on package (PoP) technology; 4.3.1 The limitations of 3D SiP; 4.3.2 The application of PoP; 4.3.3 The emphasis in PoP design; 4.4 Apple A8 processor -- an example of a PoP product.
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8 |
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|a Chapter 5 SiP Design and Simulation Flow5.1 SiP design and simulation flow; 5.2 Design and simulation process in Mentor EE Flow; 5.2.1 Library creation; 5.2.2 Schematic design; 5.2.3 Layout design; 5.2.4 Design simulation; Chapter 6 Central Library; 6.1 The structure of the central library; 6.2 Introduction to the Dashboard; 6.3 Schematic symbol creation; 6.4 Bare chip cell creation; 6.4.1 Create bare chip padstack; 6.4.2 Create bare chip cell; 6.5 BGA cell creation; 6.5.1 Create BGA padstack; 6.5.2 Create BGA cell manually; 6.5.2.1 Tips for renaming the pin numbers.
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| 505 |
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|a 6.5.2.2 View layers defined in padstacks6.5.3 Create BGA cell with Die Wizard; 6.5.4 LP Wizard professional library tool; 6.6 Part creation; 6.7 Create cell via part; Chapter 7 Schematic Input; 7.1 Netlist input; 7.2 Basic schematic input; 7.2.1 Start DxDesigner; 7.2.1.1 General toolbar; 7.2.1.2 Digital/analog simulation toolbar; 7.2.1.3 RF circuit design toolbar; 7.2.2 Create new project; 7.2.2.1 How to create a new project; 7.2.2.2 Net connection and draw toolbar; 7.2.3 Schematic design check; 7.2.4 Design rules setup; 7.2.5 Package design; 7.2.5.1 Packaging options.
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|a 7.2.5.2 PDB Extraction Options.
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| 520 |
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|a An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow, this extensively illustrated book is an indispensable working resource for every SiP designer, especially those who use Mentor design tools. --
|c Edited summary from book.
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| 504 |
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|a Includes bibliographical references and index.
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| 650 |
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0 |
|a Integrated circuits
|x Design and construction.
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| 650 |
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0 |
|a Multichip modules (Microelectronics)
|x Design and construction.
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| 650 |
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7 |
|a TECHNOLOGY & ENGINEERING
|x Mechanical.
|2 bisacsh
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| 650 |
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7 |
|a Integrated circuits
|x Design and construction
|2 fast
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| 650 |
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7 |
|a Multichip modules (Microelectronics)
|x Design and construction
|2 fast
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| 758 |
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|i has work:
|a SiP-system in package design and simulation (Text)
|1 https://id.oclc.org/worldcat/entity/E39PCFyWB7QBB94pWW86fYmgjy
|4 https://id.oclc.org/worldcat/ontology/hasWork
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| 776 |
0 |
8 |
|i Print version:
|a (Li Yang), Suny Li.
|t SiP-System in Package Design and Simulation : Mentor EE Flow Advanced Design Guide.
|d Newark : John Wiley & Sons, Incorporated, ©2017
|z 9781119045939
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| 856 |
4 |
0 |
|u https://ebookcentral.proquest.com/lib/holycrosscollege-ebooks/detail.action?docID=4915580
|y Click for online access
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|a EBC-AC
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|a 92
|b HCD
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