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00000cam a2200000 i 4500 |
| 001 |
on1110373078 |
| 003 |
OCoLC |
| 005 |
20241006213017.0 |
| 006 |
m o d |
| 007 |
cr nn||||mamaa |
| 008 |
190725s2020 sz a ob 001 0 eng d |
| 040 |
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|a LQU
|b eng
|e pn
|c LQU
|d GW5XE
|d OCLCF
|d OCLCQ
|d YDXIT
|d STF
|d OCLCQ
|d N$T
|d OCLCO
|d OCLCQ
|d OCLCO
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| 019 |
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|a 1153291861
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| 020 |
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|a 3030207730
|q (electronic book)
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| 020 |
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|a 9783030207731
|q (electronic bk.)
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| 024 |
8 |
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|a 10.1007/978-3-030-20
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| 035 |
|
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|a (OCoLC)1110373078
|z (OCoLC)1153291861
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| 050 |
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4 |
|a TJ260
|b .S24 2020
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| 049 |
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|a HCDD
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| 100 |
1 |
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|a Saha, Sujoy Kumar,
|e author.
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| 245 |
1 |
0 |
|a Electric Fields, Additives and Simultaneous Heat and Mass Transfer in Heat Transfer Enhancement /
|c Sujoy Kumar Saha, Hrishiraj Ranjan, Madhu Sruthi Emani, Anand Kumar Bharti.
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| 264 |
|
1 |
|a Cham, Switzerland :
|b Springer,
|c [2020]
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| 300 |
|
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|a 1 online resource (IX, 125 pages) :
|b illustrations (some color)
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| 336 |
|
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|a text
|b txt
|2 rdacontent
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| 337 |
|
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 490 |
1 |
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|a SpringerBriefs in Thermal Engineering and Applied Science,
|x 2193-2530
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| 504 |
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|a Includes bibliographical references and index.
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| 505 |
0 |
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|a Electrode Design, Boiling and Condensation -- Additives -- Transport Impedance.
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| 520 |
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|a This Brief deals with electrode design and placement, enhancement of both liquid and gas flow, vapor space condensation, in-tube condensation, falling film evaporation, correlations. It further provides a fundamental understanding of boiling and condensation, pool boiling, critical heat flux, convective vaporization, additives for single-phase liquids like solid particles, gas bubbles, suspensions in dilute polymer and surfactant solutions, solid additives and liquid additives for gases, additives for boiling, condensation and absorption, mass transfer resistance in gas phase (condensation with noncondensible gases, evaporation into air, dehumidifying finned tube heat exchangers, water film enhancement of finned tube exchanger), controlling resistance in liquid phase, and significant resistance in both phases. The volume is ideal for professionals and researchers dealing with thermal management in devices.
|
| 588 |
0 |
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|a Online resource; title from digital title page (viewed on May 01, 2020).
|
| 650 |
|
0 |
|a Heat
|x Transmission.
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| 650 |
|
7 |
|a heat transmission.
|2 aat
|
| 650 |
|
7 |
|a Heat
|x Transmission
|2 fast
|
| 700 |
1 |
|
|a Ranjan, Hrishiraj,
|e author.
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| 700 |
1 |
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|a Emani, Madhu Sruthi,
|e author.
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| 700 |
1 |
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|a Bharti, Anand Kumar,
|e author.
|
| 830 |
|
0 |
|a SpringerBriefs in applied sciences and technology.
|p Thermal engineering and applied science.
|
| 856 |
4 |
0 |
|u https://holycross.idm.oclc.org/login?auth=cas&url=https://link.springer.com/10.1007/978-3-030-20773-1
|y Click for online access
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| 903 |
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|a SPRING-ENGINE2020
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| 994 |
|
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|a 92
|b HCD
|