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|2 doi
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|a 10.1007/978-3-030-40
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|z (OCoLC)1153060329
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|2 bisacsh
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|a HCDD
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| 100 |
1 |
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|a Huff, Michael
|q (Michael A.),
|e author.
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1 |
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|a Process variations in microsystems manufacturing /
|c Michael Huff.
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| 264 |
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1 |
|a Cham :
|b Springer,
|c 2020.
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| 300 |
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|a 1 online resource (531 pages)
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 490 |
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|a Microsystems and Nanosystems
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|a Print version record.
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|a Intro -- Preface -- Acknowledgments -- Contents -- Chapter 1: Introduction -- 1.1 From Vacuum Tubes to Microsystems -- 1.2 MEMS Microsystems -- 1.3 Some of the Important Attributes of MEMS Microsystems -- 1.4 Organization of This Book -- References -- Other Information -- Chapter 2: An Overview of MEMS Microsystems -- 2.1 Introduction -- 2.2 Microsensors and Microactuators -- 2.2.1 MEMS Microsensors -- 2.2.1.1 Resistive -- 2.2.1.2 Piezoresistive -- 2.2.1.3 Capacitive -- 2.2.1.4 Piezoelectric -- 2.2.1.5 Tunneling -- 2.2.1.6 Magnetic -- 2.2.1.7 Photoconduction -- 2.2.1.8 Thermoelectric
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|a 2.2.1.9 Diodes -- 2.2.2 MEMS Microactuators -- 2.2.2.1 Electrostatic -- 2.2.2.2 Piezoelectric -- 2.2.2.3 Thermal -- 2.2.2.4 Shape-Memory Alloys (SMA) -- 2.2.2.5 Magnetic -- 2.3 Microsystems Manufacturing Processes -- 2.4 Batch Fabrication -- 2.5 Some Basics of Microsystems Manufacturing -- 2.5.1 Differences Between IC and MEMS Manufacturing -- 2.5.2 Microsystems Feature Sizes -- 2.6 Some Material Basics Regarding Semiconductors and Silicon -- 2.7 Summary -- References -- Chapter 3: Microsystems Manufacturing Methods: Integrated Circuit Processing Steps -- 3.1 Introduction
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|a 3.2 Basic IC Processing Steps -- 3.2.1 Thin-Film Growth and Deposition Techniques -- 3.2.1.1 Thermal Oxidation -- 3.2.1.2 Chemical Vapor Deposition -- 3.2.1.2.1 Atmospheric Chemical Vapor Deposition (ACVD) -- 3.2.1.2.2 Low-Pressure Chemical Vapor Deposition (LPCVD) -- 3.2.1.2.3 Plasma-Enhanced Chemical Vapor Deposition (PECVD) -- 3.2.1.2.4 Atomic Layer Deposition (ALD) -- 3.2.1.3 Physical Vapor Deposition (PVD) -- 3.2.1.3.1 Evaporation -- 3.2.1.3.2 Sputtering -- 3.2.2 Impurity Doping -- 3.2.2.1 Thermal Diffusion -- 3.2.2.2 Ion Implantation -- 3.2.3 Photolithography
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|a 3.2.4 Rapid Thermal Anneal (RTA) -- 3.2.5 Planarization -- 3.2.6 Etching -- 3.2.7 Clean and Strip -- 3.3 Summary -- References -- Chapter 4: Microsystems Manufacturing Methods: MEMS Processes -- 4.1 Introduction -- 4.2 MEMS Substrate Material Types -- 4.3 MEMS Materials Deposition Processing Steps -- 4.3.1 MEMS Thin-Film Materials Deposited on IC Equipment -- 4.3.1.1 Thin-Film Semiconductors -- 4.3.1.1.1 Silicon (Si) -- 4.3.1.1.2 Silicon-Germanium (SiGe) -- 4.3.1.1.3 Germanium (Ge) -- 4.3.1.1.4 Silicon Carbide (SiC) -- 4.3.1.1.5 Diamond -- 4.3.1.2 Metals -- 4.3.1.3 Thin-Film Metal Oxides
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|a 4.3.1.4 Dielectrics -- 4.3.1.4.1 Silicon Nitride (SiN) -- 4.3.1.4.2 Silicon Dioxide (SiO2) -- 4.3.1.5 Polymers -- 4.3.1.5.1 SU-8 -- 4.3.1.5.2 PDMS -- 4.3.1.5.3 Polyimide -- 4.3.1.6 Ceramics -- 4.3.1.7 Special MEMS Materials -- 4.3.1.7.1 Piezoelectric Materials -- 4.3.1.7.2 Shape-Memory Alloys (SMAs) -- 4.3.1.7.3 Magnetic Materials -- 4.3.2 MEMS Specific Processing Steps -- 4.3.2.1 Electrochemical Deposition -- 4.3.2.2 MEMS Lithography -- 4.3.2.2.1 Contact Photolithography -- 4.3.2.2.2 Front-to-Back Contact Photolithography -- 4.3.2.2.3 Direct-Write Laser Photolithography
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| 500 |
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|a 4.3.2.2.4 Grayscale Photolithography
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| 504 |
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|a Includes bibliographical references and index.
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| 520 |
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|a This book thoroughly examines and explains the basic processing steps used in MEMS fabrication (both integrated circuit and specialized micro machining processing steps. The book places an emphasis on the process variations in the device dimensions resulting from these commonly used processing steps. This will be followed by coverage of commonly used metrology methods, process integration and variations in material properties, device parameter variations, quality assurance and control methods, and design methods for handling process variations. A detailed analysis of future methods for improved microsystems manufacturing is also included. This book is a valuable resource for practitioners, researchers and engineers working in the field as well as students at either the undergraduate or graduate level. Examines and explains the basic processing steps used in MEMS fabrication; Illustrates best practices and lessons learned in manufacturing of microsystems for commercial products with detailed case studies; Reviews future methods that may provide for improved process variations.
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|a Microelectromechanical systems.
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| 650 |
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|a Production engineering.
|2 bicssc
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| 650 |
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|a Nanotechnology.
|2 bicssc
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|a Circuits & components.
|2 bicssc
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|a Precision instruments manufacture.
|2 bicssc
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|a Technology & Engineering
|x Manufacturing.
|2 bisacsh
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|a Technology & Engineering
|x Nanotechnology & MEMS.
|2 bisacsh
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|a Technology & Engineering
|x Electronics
|x Circuits
|x General.
|2 bisacsh
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|a Microelectromechanical systems
|2 fast
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|i Print version:
|a Huff, Michael.
|t Process Variations in Microsystems Manufacturing.
|d Cham : Springer, ©2020
|z 9783030405588
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| 830 |
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0 |
|a Microsystems and nanosystems.
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| 856 |
4 |
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|u https://holycross.idm.oclc.org/login?auth=cas&url=https://link.springer.com/10.1007/978-3-030-40560-1
|y Click for online access
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|a SPRING-ENGINE2020
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|a 92
|b HCD
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