Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology edited by John W. Balde.

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages...

Full description

Saved in:
Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Balde, John W. (Editor)
Format: eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 2003.
Edition:1st ed. 2003.
Series:Emerging Technology in Advanced Packaging, 1
Springer eBook Collection.
Subjects:
Manufactures.
Chemistry, Physical and theoretical.
Electrical engineering.
Optical materials.
Electronic materials.
Electronic resources (E-books)
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.
Login for hold information

‌

Click to view e-book

Online

Holdings details from Online
Call Number: E-Book
Copy 1 Available

Similar Items