Foldable Flex and Thinned Silicon Multichip Packaging Technology edited by John W. Balde.

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages...

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Bibliographic Details
Corporate Author:	SpringerLink (Online service)
Other Authors:	Balde, John W. (Editor)
Format:	eBook
Language:	English
Published:	New York, NY : Springer US : Imprint: Springer, 2003.
Edition:	1st ed. 2003.
Series:	Emerging Technology in Advanced Packaging, 1 Springer eBook Collection.
Subjects:	Manufactures. Chemistry, Physical and theoretical. Electrical engineering. Optical materials. Electronic materials. Electronic resources (E-books)
Online Access:	Click to view e-book
Holy Cross Note:	Loaded electronically. Electronic access restricted to members of the Holy Cross Community.

Table of Contents:

1. 3-D Assemblies of Stacked Chips and other Thin Packages
2. Multi-Chip Carriers in a System-on-a-Chip World
3. Packaging Technologies for Flexible Systems
4. Low Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon - The European Flex-Si Project
5. Thin Chips for Flexible and 3-D Integrated Electronic Systems
6. Flexible Microarray Interconnection Techniques Applied to Biomedical Microdevices
7. Folded Flex and other Structures for System-in-a Package
8. Valtronic CSP3D Technology
9. 3-D Packaging Technologies: Are Flex based Solutions the Answer?
10. Availability of High Density Interconnect Flexible Circuits
11. Recent Advances in Flexible Circuit Technology Using Liquid Crystal Polymer Substrates
12. Flex and the Interconnected Mesh Power System (IMPS)
13. Thermal Management and Control of Electromagnetic Emissions
Conclusions
Authors’ Biographies.

Foldable Flex and Thinned Silicon Multichip Packaging Technology edited by John W. Balde.

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