Area Array Interconnection Handbook

Area Array Interconnection Handbook edited by Karl J. Puttlitz, Paul A. Totta.

Microelectronic packaging has been recognized as an important "enabler" for the solid­ state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Puttlitz, Karl J. (Editor), Totta, Paul A. (Editor)
Format: eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 2001.
Edition:1st ed. 2001.
Series:Springer eBook Collection.
Subjects:
Electronic circuits.
Manufactures.
Climate change.
Electrical engineering.
Electronic resources (E-books)
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Call Number: E-Book
Status: Available

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