Multichip Module Technologies and Alternatives: The Basics by Daryl Ann Doane, Paul Franzon.

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to imp...

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Bibliographic Details
Main Authors: Doane, Daryl Ann (Author), Franzon, Paul (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 1993.
Edition:1st ed. 1993.
Series:Springer eBook Collection.
Subjects:
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.