Multichip Module Technologies and Alternatives: The Basics

Multichip Module Technologies and Alternatives: The Basics by Daryl Ann Doane, Paul Franzon.

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to imp...

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Bibliographic Details
Main Authors: Doane, Daryl Ann (Author), Franzon, Paul (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 1993.
Edition:1st ed. 1993.
Series:Springer eBook Collection.
Subjects:
Microprogramming .
Manufactures.
Microprocessors.
Electronic resources (E-books)
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.
Table of Contents:
  • A: The Framework
  • 1 Introduction
  • 2 MCM Package Selection: A Materials and Manufacturing Perspective
  • 3 MCM Package Selection: A Systems Need Perspective
  • 4MCM Package Selection: Cost Issues
  • B: The Basics
  • 5 Laminate-Based Technologies for Multichip Modules
  • 6 Thick Film and Ceramic Technologies for Hybrid Multichip Modules
  • 7 Thin Film Multilayer Interconnection Technologies for Multichip Modules
  • 8 Selection Criteria For Multichip Module Dielectrics
  • 9 Chip-to-Substrate (First Level) Connection Technology Options
  • 10 MCM-to-Printed Wiring Board (Second Level) Connection Technology Options
  • 11 Electrical Design of Digital Multichip Modules
  • 12 Thermal Design Considerations for Multichip Module Applications
  • 13 Electrical Testing of Multichip Modules
  • C: Case Studies661
  • 14 The Development of Unisys Multichip Modules
  • 15 High Performance Aerospace Multichip Module Technology Development at Hughes
  • 16 Silicon-Based Multichip Modules
  • 17 The Technology and Manufacture of the VAX-9000 Multichip Unit
  • D: Closing the Loop815
  • 18 Complementing Technologies for MCM Success.

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