Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications by Dean L. Monthei.

This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However, the principles involved translate well to other categories of...

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Bibliographic Details
Main Author: Monthei, Dean L. (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 1999.
Edition:1st ed. 1999.
Series:Electronic Packaging and Interconnects, 2
Springer eBook Collection.
Subjects:
Microwaves.
Optical engineering.
Control engineering.
Robotics.
Mechatronics.
Electrical engineering.
Electronic resources (E-books)
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Call Number: E-Book
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