High-Frequency Characterization of Electronic Packaging

High-Frequency Characterization of Electronic Packaging by Luc Martens.

High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in b...

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Bibliographic Details
Main Author: Martens, Luc (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 1998.
Edition:1st ed. 1998.
Series:Electronic Packaging and Interconnects, 1
Springer eBook Collection.
Subjects:
Microwaves.
Optical engineering.
Control engineering.
Robotics.
Mechatronics.
Electrical engineering.
Electronic resources (E-books)
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Call Number: E-Book
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