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|a 10.1007/978-1-4615-5623-7
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|a Martens, Luc.
|e author.
|4 aut
|4 http://id.loc.gov/vocabulary/relators/aut
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|a High-Frequency Characterization of Electronic Packaging
|h [electronic resource] /
|c by Luc Martens.
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|a 1st ed. 1998.
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|a New York, NY :
|b Springer US :
|b Imprint: Springer,
|c 1998.
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| 300 |
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|a XII, 158 p.
|b online resource.
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|a text
|b txt
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|a Electronic Packaging and Interconnects,
|x 1389-2169 ;
|v 1
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|a Springer eBook Collection
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|a 1: Electronic Packaging and High Frequencies -- 1.1 Packaging and high-frequency effects -- 1.2 Overview of the book chapters -- References -- 2: Electrical Description of Electronic Packaging -- 2.1 Introduction -- 2.2 Circuit descriptions -- 2.3 Qualitative characteristics -- 2.4 Conclusions -- References -- 3: High-Frequency Measurement Techniques -- 3.1 Introduction -- 3.2 Frequency-domain instruments -- 3.3 Time-domain network analyzer -- 3.4 Comparison of frequency- and time-domain network analyzers -- 3.5 Error correction -- 3.6 Conclusion -- References Appendix 3.A: Spatial resolution of the TDR/T-technique -- 4: High-Frequency Measurement Techniques for Electronic Packaging -- 4.1 Introduction -- 4.2 General test fixtures -- 4.3 Dedicated test fixtures with coaxial-planar transitions -- 4.4 On-board probing -- 4.5 Comparison of the coaxial-planar and coplanar probe transitions -- 4.6 De-embedding -- 4.7 Measuring 2N-port structures with two-port instruments -- 4.8 Conclusion -- References -- 5: Measurement-Based Modeling Algorithms -- 5.1 Introduction -- 5.2 One-port components -- 5.3 Transmission lines -- 5.4 General interconnections and packaging -- 5.5 Conclusions -- References.
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|a High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
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|a Loaded electronically.
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|a Electronic access restricted to members of the Holy Cross Community.
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|a Microwaves.
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|a Optical engineering.
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|a Control engineering.
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|a Robotics.
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|a Mechatronics.
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|a Electrical engineering.
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