High-Frequency Characterization of Electronic Packaging

High-Frequency Characterization of Electronic Packaging by Luc Martens.

High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in b...

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Bibliographic Details
Main Author: Martens, Luc (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 1998.
Edition:1st ed. 1998.
Series:Electronic Packaging and Interconnects, 1
Springer eBook Collection.
Subjects:
Microwaves.
Optical engineering.
Control engineering.
Robotics.
Mechatronics.
Electrical engineering.
Electronic resources (E-books)
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.
Table of Contents:
  • 1: Electronic Packaging and High Frequencies
  • 1.1 Packaging and high-frequency effects
  • 1.2 Overview of the book chapters
  • References
  • 2: Electrical Description of Electronic Packaging
  • 2.1 Introduction
  • 2.2 Circuit descriptions
  • 2.3 Qualitative characteristics
  • 2.4 Conclusions
  • References
  • 3: High-Frequency Measurement Techniques
  • 3.1 Introduction
  • 3.2 Frequency-domain instruments
  • 3.3 Time-domain network analyzer
  • 3.4 Comparison of frequency- and time-domain network analyzers
  • 3.5 Error correction
  • 3.6 Conclusion
  • References Appendix 3.A: Spatial resolution of the TDR/T-technique
  • 4: High-Frequency Measurement Techniques for Electronic Packaging
  • 4.1 Introduction
  • 4.2 General test fixtures
  • 4.3 Dedicated test fixtures with coaxial-planar transitions
  • 4.4 On-board probing
  • 4.5 Comparison of the coaxial-planar and coplanar probe transitions
  • 4.6 De-embedding
  • 4.7 Measuring 2N-port structures with two-port instruments
  • 4.8 Conclusion
  • References
  • 5: Measurement-Based Modeling Algorithms
  • 5.1 Introduction
  • 5.2 One-port components
  • 5.3 Transmission lines
  • 5.4 General interconnections and packaging
  • 5.5 Conclusions
  • References.

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