Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications edited by Yosi Shacham-Diamand, Tetsuya Osaka, Madhav Datta, Takayuki Ohba.

Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copp...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Shacham-Diamand, Yosi (Editor), Osaka, Tetsuya (Editor), Datta, Madhav (Editor), Ohba, Takayuki (Editor)
Format: eBook
Language:English
Published: New York, NY : Springer New York : Imprint: Springer, 2009.
Edition:1st ed. 2009.
Series:Springer eBook Collection.
Subjects:
Electrochemistry.
Materials science.
Chemical engineering.
Electrical engineering.
Nanotechnology.
Electronic resources (E-books)
Online Access:Click to view e-book
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Call Number: E-Book
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