Carbon Nanotubes for Interconnects Process, Design and Applications / edited by Aida Todri-Sanial, Jean Dijon, Antonio Maffucci.
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...
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