Materials for Information Technology Devices, Interconnects and Packaging

Materials for Information Technology Devices, Interconnects and Packaging / edited by Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick.

The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of mate...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Zschech, Ehrenfried (Editor), Whelan, Caroline (Editor), Mikolajick, Thomas (Editor)
Format: eBook
Language:English
Published: London : Springer London : Imprint: Springer, 2005.
Edition:1st ed. 2005.
Series:Engineering Materials and Processes,
Springer eBook Collection.
Subjects:
Engineering.
Electronics.
Microelectronics.
Solid state physics.
Spectroscopy.
Microscopy.
Ceramics.
Glass.
Composites (Materials).
Composite materials.
Materials—Surfaces.
Thin films.
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