Lead Free Solder Mechanics and Reliability

Lead Free Solder Mechanics and Reliability / by John Hock Lye Pang.

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free sol...

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Bibliographic Details
Main Author: Pang, John Hock Lye (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York, NY : Springer New York : Imprint: Springer, 2012.
Edition:1st ed. 2012.
Series:Springer eBook Collection.
Subjects:
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Mechanics.
Mechanics, Applied.
Electronic circuits.
Electronic resources (E-books)
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Call Number: E-Book
Status: Available

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