Electrical Design of Through Silicon Via

Electrical Design of Through Silicon Via edited by Manho Lee, Jun So Pak, Joungho Kim.

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Lee, Manho (Editor), Pak, Jun So (Editor), Kim, Joungho (Editor)
Format: eBook
Language:English
Published: Dordrecht : Springer Netherlands : Imprint: Springer, 2014.
Edition:1st ed. 2014.
Series:Springer eBook Collection.
Subjects:
Electronic circuits.
Special purpose computers.
Electronic resources (E-books)
Online Access:Click to view e-book
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Call Number: E-Book
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