Advanced Flip Chip Packaging

Advanced Flip Chip Packaging edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong.

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for f...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Tong, Ho-Ming (Editor), Lai, Yi-Shao (Editor), Wong, C.P (Editor)
Format: eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 2013.
Edition:1st ed. 2013.
Series:Springer eBook Collection.
Subjects:
Electronics.
Microelectronics.
Electronic circuits.
Optical materials.
Electronic materials.
Electronic resources (E-books)
Online Access:Click to view e-book
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Call Number: E-Book
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