Design of Adhesive Joints Under Humid Conditions

Design of Adhesive Joints Under Humid Conditions edited by Lucas F. M. da Silva, Chiaki Sato.

This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It  presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increa...

Full description

Saved in:
Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: da Silva, Lucas F. M. (Editor), Sato, Chiaki (Editor)
Format: eBook
Language:English
Published: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2013.
Edition:1st ed. 2013.
Series:Advanced Structured Materials, 25
Springer eBook Collection.
Subjects:
Materials—Surfaces.
Thin films.
Mechanics.
Mechanics, Applied.
Polymers  .
Aerospace engineering.
Astronautics.
Electronic resources (E-books)
Online Access:Click to view e-book
Holy Cross Note:Loaded electronically.
Electronic access restricted to members of the Holy Cross Community.
Login for hold information

‌

Click to view e-book

Online

Holdings details from Online
Call Number: E-Book
Copy 1 Available

Similar Items