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|a 827211774
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|a 1135523747
|a 1152707034
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|a 9004190953
|q (electronic bk.)
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|a 9789004190955
|q (electronic bk.)
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|z 9789004190948
|q (hbk.)
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|z 9004190945
|q (hbk.)
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|a 9781615839476
|q (electronic bk.)
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|a 161583947X
|q (electronic bk.)
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|a (OCoLC)824353879
|z (OCoLC)827211774
|z (OCoLC)1086913520
|z (OCoLC)1135523747
|z (OCoLC)1152707034
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|a TANDF_274379
|b Ingram Content Group
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|a TK7875
|b .A34 2010
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|a TEC
|x 008060
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|a HCDD
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|a Adhesion aspects in MEMS-NEMS /
|c edited by S.H. Kim, M.T. Dugger and K.L. Mittal.
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260 |
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|a Leiden ;
|a Boston :
|b Vsp,
|c ©2010.
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300 |
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|a 1 online resource (xi, 409 pages) :
|b illustrations
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336 |
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
|b cr
|2 rdacarrier
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|a Includes bibliographical references.
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|a Print version record.
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|a Front Cover; Contents; Preface; Part 1: Understanding Through Continuum Theory; Numerical Analysis of Contact Mechanics between a Spherical Slider and a Flat Disk with Low Roughness Considering Lennard-Jones Surface Forces; Equilibrium Vapor Adsorption and Capillary Force: Exact Laplace-Young Equation Solution and Circular Approximation Approaches; Which Fractal Parameter Contributes Most to Adhesion?; Effects of Contacting Surfaces on MEMS Device Reliability; A van der Waals Force-Based Adhesion Model for Micromanipulation; Part 2: Computer Simulation of Interfaces.
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|a Lattice Gas Monte Carlo Simulation of Capillary Forces in Atomic Force MicroscopyLarge Scale Molecular Dynamics Simulations of Vapor Phase Lubrication for MEMS; Atomistic Factors Governing Adhesion between Diamond, Amorphous Carbon and Model Diamond Nanocomposite Surfaces; Part 3: Adhesion and Friction Measurements; Theoretical and Experimental Study of the Influence of AFM Tip Geometry and Orientation on Capillary Force; Odd-Even Effects in the Friction of Self-Assembled Monolayers of Phenyl-Terminated Alkanethiols in Contacts of Different Adhesion Strengths.
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|a The Pull-Off Force and the Work of Adhesion: New Challenges at the NanoscaleInterfacial Adhesion between Rough Surfaces of Polycrystalline Silicon and Its Implications for M/NEMS Technology; Effect of Air-Plasma Pre-treatment of Si Substrate on Adhesion Strength and Tribological Properties of a UHMWPE Film; Part 4: Adhesion in Practical Applications; A Review of Adhesion in an Ohmic Microswitch; Characterization of Gold-Gold Microcontact Behavior Using a Nanoindenter Based Setup; Characterization and Adhesion of Interacting Surfaces in Capacitive RF MEMS Switches Undergoing Cycling.
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|a Molecular Mobility and Interfacial Dynamics in Organic Nano-electromechanical Systems (NEMS)Part 5: Adhesion Mitigation Strategies; Microscale Friction Reduction by Normal Force Modulation in MEMS; Microchannel Induced Surface Bulging of a Soft Elastomeric Layer; Fabrication of Novel Superhydrophobic Surfaces and Water Droplet Bouncing Behavior -Part 1: Stable ZnO-PDMS Superhydrophobic Surface with Low Hysteresis Constructed Using ZnO Nanoparticles; Plasma Modification of Polymer Surfaces and Their Utility in Building Biomedical Microdevices.
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|a Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects owing to their small size and limited actuation force that can be generated. Extension of MEMS technology concepts to the nanoscale and development of NanoElectroMechanicalSystems(NEMS) will result in systems even more strongly influenced by surface.
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|a Microelectromechanical systems.
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|a Nanoelectromechanical systems.
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|a Adhesion.
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|a Surfaces (Technology)
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|a adhesion.
|2 aat
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|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Digital.
|2 bisacsh
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|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Microelectronics.
|2 bisacsh
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|a Adhesion
|2 fast
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|a Microelectromechanical systems
|2 fast
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|a Nanoelectromechanical systems
|2 fast
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|a Surfaces (Technology)
|2 fast
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|a Kim, Seong H.
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|a Dugger, M. T.
|q (Michael T.)
|1 https://id.oclc.org/worldcat/entity/E39PCjFXgpFH3pKjpHrTkBpWrC
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700 |
1 |
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|a Mittal, K. L.,
|d 1945-
|1 https://id.oclc.org/worldcat/entity/E39PCjKv8H9WwJxmb89dhKchpd
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758 |
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|i has work:
|a Adhesion aspects in MEMSMS (Text)
|1 https://id.oclc.org/worldcat/entity/E39PCFyxKDYPbB6KJMq4BXWwbq
|4 https://id.oclc.org/worldcat/ontology/hasWork
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|i Print version:
|z 9789004190948
|z 9004190945
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856 |
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|u https://ebookcentral.proquest.com/lib/holycrosscollege-ebooks/detail.action?docID=1109848
|y Click for online access
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|a EBC-AC
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|a 92
|b HCD
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