Hermeticity testing of MEMS and microelectronic packages

Hermeticity testing of MEMS and microelectronic packages / Suzanne Costello, Marc P.Y. Desmulliez.

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mecha...

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Bibliographic Details
Main Authors: Costello, Suzanne (Author), Desmulliez, Marc P. Y., 1963- (Author)
Format: eBook
Language:English
Published: Boston : Artech House, [2013]
Series:Artech House integrated microsystems series.
Subjects:
Microelectronic packaging > Testing.
Microelectromechanical systems > Testing.
Hermetic sealing > Testing.
Microelectronics > Testing.
Microelectronics > Testing
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