Skip to content
Library Home
Start Over
Research Databases
E-Journals
Course Reserves
Library Home
Login to library account
English
Deutsch
Español
Français
Italiano
日本語
Nederlands
Português
Português (Brasil)
中文(简体)
中文(繁體)
Türkçe
עברית
Gaeilge
Cymraeg
Ελληνικά
Català
Euskara
Русский
Čeština
Suomi
Svenska
polski
Dansk
slovenščina
اللغة العربية
বাংলা
Galego
Tiếng Việt
Hrvatski
हिंदी
Հայերէն
Українська
Language
Library Catalog
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Find
Advanced Search
|
Browse
|
Search Tips
IMAPS Poland 2016.
Cite this
Text this
Email this
Print
Export Record
Export to RefWorks
Export to EndNoteWeb
Export to EndNote
Save to List
Permanent link
IMAPS Poland 2016.
Saved in:
Bibliographic Details
Main Author:
Goosey, Martin
Other Authors:
Skwarek, Agata
Format:
eBook
Language:
English
Published:
Bradford, West Yorkshire :
Emerald Publishing Limited,
2017.
Series:
Soldering & Surface Mount Technology.
Subjects:
Microelectronic packaging
>
Congresses.
Interconnects (Integrated circuit technology)
>
Congresses.
Interconnects (Integrated circuit technology)
Microelectronic packaging
Conference papers and proceedings
Online Access:
Click for online access
Holdings
Description
Table of Contents
Similar Items
Staff View
Login for hold information
Click for online access
Online
Holdings details from Online
Status:
Available
Similar Items
IMAPS (2016).
by: Baoyong, Chi
Published: (2017)
Interconnect reliability in advanced memory device packaging
by: Gan, Chong Leong, et al.
Published: (2023)
Chiplet design and heterogeneous integration packaging
by: Lau, John H.
Published: (2023)
3D interconnect architectures for heterogeneous technologies : modeling and optimization
by: Bamberg, Lennart
Published: (2022)
Photonic Interconnects for Computing Systems
by: Nicolescu, Gabriela
Published: (2017)