IMAPS Poland 2016.

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Bibliographic Details
Main Author:	Goosey, Martin
Other Authors:	Skwarek, Agata
Format:	eBook
Language:	English
Published:	Bradford, West Yorkshire : Emerald Publishing Limited, 2017.
Series:	Soldering & Surface Mount Technology.
Subjects:	Microelectronic packaging > Congresses. Interconnects (Integrated circuit technology) > Congresses. Interconnects (Integrated circuit technology) Microelectronic packaging Conference papers and proceedings
Online Access:	Click for online access

Table of Contents:

Cover; Guest editorial; New method for determining correction factors for pin-in-paste solder volumes; Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing; Optimization of solder paste quantity considering the properties of solder joints; The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials; X-ray inspection and Six-Sigma in analysis of LED thermal pad coverage; Studying heat transfer on inclined printed circuit boards during vapour phase soldering.
Real-time profiling of reflow process in VPS chamberStructure and thermal behavior of lead-free solders prepared by rapid solidification of their melt; Stability of electrical properties for mechanically exposed thick- and thin-film resistors on flexible substrates; Corrosion-induced tin whisker growth in electronic devices: a review.

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