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Development of Sub-mm Wave Fli...
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Development of Sub-mm Wave Flip-Chip Interconnect.
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Bibliographic Details
Main Author:
Monayakul, Sirinpa
Format:
eBook
Language:
English
Published:
Göttingen :
Cuvillier Verlag,
2016.
Series:
Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik ;
bd. 38.
Subjects:
Gold alloys.
Eutectic alloys.
Flip chip technology.
gold alloy.
Eutectic alloys
Flip chip technology
Gold alloys
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