Development of Sub-mm Wave Flip-Chip Interconnect.

Development of Sub-mm Wave Flip-Chip Interconnect.

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Bibliographic Details
Main Author:	Monayakul, Sirinpa
Format:	eBook
Language:	English
Published:	Göttingen : Cuvillier Verlag, 2016.
Series:	Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik ; bd. 38.
Subjects:	Gold alloys. Eutectic alloys. Flip chip technology. gold alloy. Eutectic alloys Flip chip technology Gold alloys
Online Access:	Click for online access

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