Advances in embedded and fan-out wafer level packaging technologies

Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser and Steffen Kröhnert.

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging "FO-WLP" technologies have been developed across the industry over the...

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Bibliographic Details
Other Authors: Keser, Beth, 1971- (Editor), Kroehnert, Steffen, 1970- (Editor)
Format: eBook
Language:English
Published: Hoboken, NJ, USA : John Wiley & Sons, Inc., 2019.
Subjects:
Chip scale packaging.
Integrated circuits > Wafer-scale integration.
TECHNOLOGY & ENGINEERING > Mechanical.
Chip scale packaging
Integrated circuits > Wafer-scale integration
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