3D microelectronic packaging : from architectures to applications

3D microelectronic packaging : from architectures to applications / Yan Li, Deepak Goyal, editors.

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research...

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Bibliographic Details
Other Authors: Li, Yan (Editor), Goyal, Deepak (Electrical engineer) (Editor)
Format: Electronic eBook
Language:English
Published: Singapore : Springer, [2021]
Edition:Second edition.
Series:Springer series in advanced microelectronics ; 64.
Subjects:
Microelectronics > Packaging.
Electronic circuits.
Electronics.
Optical materials.
Electronics > Materials.
Biotechnology.
Nanotechnology.
Metals.
bioengineering.
metal.
Biotechnology
Electronic circuits
Electronics
Electronics > Materials
Engineering
Metals
Microelectronics
Nanotechnology
Optical materials
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